Transfer molded PCMCIA standard cards

Abstract

A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.

The invention claimed is: 
     
       1. A transfer-molded PC card standard or small form factor card electronic package, comprising: a substrate having an integrated circuit package thereon and an electrical connector along a side of the substrate;   an upper cover over at least a portion of the substrate and the electrical connector;   a lower cover over at least a portion of the substrate and the electrical connector;   a transfer-molded encapsulant covering the substrate and a portion of the upper cover and the lower cover; and   wherein the portion of the upper cover and the lower cover covered by the encapsulant comprises a first flange attached to a portion of a periphery of the upper cover and a second flange attached to a portion of a periphery of the lower cover.   
     
     
       2. The transfer-molded PC card standard or small form factor card electronic package of claim 1 wherein the first flange is in contact with a first surface of the substrate to form a seal between the upper cover and the substrate and the second flange is in contact with a second surface of the substrate to form a seal between the lower cover and the substrate. 
     
     
       3. The transfer-molded PC card standard or small form factor card electronic package of claim 2 further comprising a switch on the substrate wherein the upper cover comprises a first raised portion over the electrical connector with a first flange around a portion of a periphery of the first raised portion and a second raised portion over the switch with a second flange around a portion of a periphery of the second raised portion. 
     
     
       4. The transfer-molded PC card standard or small form factor card electronic package of claim 3 wherein the portion of the upper cover covered by the encapsulant comprises the first flange and the second flange. 
     
     
       5. The transfer-molded PC card standard or small form factor card electronic package of claim 3 wherein the lower cover comprises a raised portion over the electrical connector with a flange around a portion of a periphery of the raised portion of the lower cover. 
     
     
       6. The transfer-molded PC card standard or small form factor card electronic package of claim 3 wherein the second raised portion has an opening therethrough to expose the switch.