Inventor · disambiguated record
Patrick Weber
Also filed as: WEBER PATRICK · WEBER PATRICK O
56 granted patents·19 pending applications·1,485 citations·filing 1995–2025
98Inventor score
Files withSAINT GOBAIN20HESTIA TECHNOLOGIES INC18FREUDENBERG CARL KG6BOSCH GMBH ROBERT5EVEREADY BATTERY INC4
Top patents by PatentIndex Score
75 records- 0197US7171281B2Control system and method thereforEVEREADY BATTERY INC·Filed 2003·Granted Jan 30, 2007·90 cites·22 claims
- 0295US6038136AChip package with molded underfillHESTIA TECHNOLOGIES INC·Filed 1997·Granted Mar 14, 2000·219 cites·12 claims
- 0395US5798014AMethods of making multi-tier laminate substrates for electronic device packagingHESTIA TECHNOLOGIES INC·Filed 1996·Granted Aug 25, 1998·183 cites·15 claims
- 0494US11525538B2Quick-release Johnston couplingNEXANS·Filed 2020·Granted Dec 13, 2022·4 cites·13 claims
- 0593US6667439B2Integrated circuit package including opening exposing portion of an ICAUTHENTEC INC·Filed 2001·Granted Dec 23, 2003·84 cites·58 claims
- 0692US6615091B1Control system and method thereforEVEREADY BATTERY INC·Filed 2000·Granted Sep 2, 2003·126 cites·36 claims
- 0790US6324069B1Chip package with molded underfillHESTIA TECHNOLOGIES INC·Filed 1999·Granted Nov 27, 2001·95 cites·15 claims
- 0890US5609889AApparatus for encapsulating electronic packagesHESTIA TECHNOLOGIES INC·Filed 1995·Granted Mar 11, 1997·98 cites·4 claims
- 0989US10949004B2Lighting laminated glazing with a capacitive touch sensitive device and a light emitting diode and the manufacturingSAINT GOBAIN·Filed 2017·Granted Mar 16, 2021·3 cites·22 claims
- 1089US6560122B2Chip package with molded underfillHESTIA TECHNOLOGIES INC·Filed 2001·Granted May 6, 2003·47 cites·13 claims
- 1188US7049166B2Methods and apparatus for making integrated circuit package including opening exposing portion of the ICHESTIA TECHNOLOGIES INC·Filed 2001·Granted May 23, 2006·51 cites·29 claims
- 1287US7831323B2Control system and method thereforEVEREADY BATTERY INC·Filed 2007·Granted Nov 9, 2010·14 cites·15 claims
- 1386US5622588AMethods of making multi-tier laminate substrates for electronic device packagingHESTIA TECHNOLOGIES INC·Filed 1995·Granted Apr 22, 1997·75 cites·15 claims
- 1485US11052640B2Laminated glass pane having a sensor assembly, receiver antenna and transmission system, and method for producing a laminated glass pane having a sensor assemblySAINT GOBAIN·Filed 2017·Granted Jul 6, 2021·2 cites·14 claims
- 1585US9651191B1Modular basin apparatusAesh Design LLC·Filed 2016·Granted May 16, 2017·12 cites·13 claims
- 1684US10743375B2Pane assembly having a heatable composite pane having a capacitive switching regionSAINT GOBAIN·Filed 2016·Granted Aug 11, 2020·2 cites·19 claims
- 1783US6157086AChip package with transfer mold underfillFiled 1999·Granted Dec 5, 2000·60 cites·10 claims
- 1882US10201233B2Modular basin apparatusGRISHAM DAVID·Filed 2017·Granted Feb 12, 2019·6 cites·28 claims
- 1980US10775948B2Touch control glazing with a capacitive touch sensitive device and a light emitting diode and the manufacturingSAINT GOBAIN·Filed 2017·Granted Sep 15, 2020·1 cites·23 claims
- 2077US11680922B2Window pane with capacitive sensorSAINT GOBAIN·Filed 2017·Granted Jun 20, 2023·1 cites·15 claims
- 2177US9900932B2Panel heater with temperature monitoringDEGEN CHRISTOPH·Filed 2011·Granted Feb 20, 2018·6 cites·17 claims
- 2277US5776512AApparatus for encapsulating electronic packagesHESTIA TECHNOLOGIES INC·Filed 1996·Granted Jul 7, 1998·45 cites·6 claims
- 2376US5652463ATransfer modlded electronic package having a passage meansHESTIA TECHNOLOGIES INC·Filed 1995·Granted Jul 29, 1997·48 cites·22 claims
- 2475US10827628B2Assembly for connecting a flat body to a voltage supply with an embedded control unitSAINT GOBAIN·Filed 2017·Granted Nov 3, 2020·2 cites·14 claims
- 2575US10638549B2Electrically heatable pane with switch regionSAINT GOBAIN·Filed 2015·Granted Apr 28, 2020·5 cites·23 claims
- 2675US10523201B2Pane arrangement with pane with low-E coating and capacitive switching regionSAINT GOBAIN·Filed 2016·Granted Dec 31, 2019·1 cites·20 claims
- 2773US5597643AMulti-tier laminate substrate with internal heat spreaderHESTIA TECHNOLOGIES INC·Filed 1995·Granted Jan 28, 1997·40 cites·9 claims
- 2872US12209511B2Turbine arrangement with separate guide deviceBORGWARNER INC·Filed 2021·Granted Jan 28, 2025·1 cites·18 claims
- 2972US6128195ATransfer molded PCMCIA standard cardsHESTIA TECHNOLOGIES INC·Filed 1997·Granted Oct 3, 2000·37 cites·6 claims
- 3071US10525673B2Composite pane with a capacitive switching zoneSAINT GOBAIN·Filed 2016·Granted Jan 7, 2020·2 cites·26 claims
- 3165US5728248AMethod for making a multi-tier laminate substrate with internal heat spreaderHESTIA TECHNOLOGIES INC·Filed 1996·Granted Mar 17, 1998·28 cites·20 claims
- 3265US2024410718A1Optical detection of the opening of a housingSAGEMCOM ENERGY & TELECOM SAS·Filed 2024·Application pending·0 cites
- 3362US5689137AMethod for transfer molding standard electronic packages and apparatus formed therebyHESTIA TECHNOLOGIES INC·Filed 1995·Granted Nov 18, 1997·23 cites·21 claims
- 3462US2024330873A1Method and apparatus for improved vehicular maintenance schedulingFORD GLOBAL TECH LLC·Filed 2024·Application pending·0 cites
- 3561USD791294SModular fire pitAesh Design LLC·Filed 2016·Granted Jul 4, 2017·11 cites·1 claims
- 3659US6495083B2Method of underfilling an integrated circuit chipHESTIA TECHNOLOGIES INC·Filed 1999·Granted Dec 17, 2002·20 cites·14 claims
- 3759US2025328115A1Techniques for validating or verifying closed-loop test platformsBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 3859US2024017197A1Filter having filter media sets which are arranged in a v-shaped manner and a frameFREUDENBERG CARL KG·Filed 2023·Application pending·0 cites
- 3959US2024017200A1Filter with filter media packs arranged in a v-shape and flow-optimized shapingFREUDENBERG CARL KG·Filed 2023·Application pending·0 cites
- 4059US2025003904A1Detecting humidity by measuring impedance between two tracksSAGEMCOM ENERGY & TELECOM SAS·Filed 2024·Application pending·0 cites
- 4158US5929522ASemiconductor non-laminate package and methodHESTIA TECHNOLOGIES INC·Filed 1998·Granted Jul 27, 1999·19 cites·11 claims
- 4257US2024069108A1Method for evaluating the quantity of electrical energy consumed by a communicating objectSAGEMCOM ENERGY & TELECOM SAS·Filed 2023·Application pending·0 cites
- 4355US2025256225A1Filter with filter media sets which are arranged in a v-shaped manner and a frameFREUDENBERG CARL KG·Filed 2025·Application pending·0 cites
- 4454US11598467B2Johnston coupling with galvanic separationNEXANS·Filed 2021·Granted Mar 7, 2023·0 cites·5 claims
- 4554US11054681B2Device for operating functional elements having electrically controllable optical propertiesSAINT GOBAIN·Filed 2018·Granted Jul 6, 2021·0 cites·18 claims
- 4654US2025320867A1Fluid pumpVALEO EMBRAYAGES·Filed 2025·Application pending·0 cites
- 4753US2010014234A1Light-Emitting Pixel Array Package And Method of Manufacturing The SameHESTIA TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 4852US12122125B2Laminated glass pane comprising an electronic functional moduleSAINT GOBAIN·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 4952US12014334B2System for improved vehicular maintenance schedulingFORD GLOBAL TECH LLC·Filed 2017·Granted Jun 18, 2024·0 cites·10 claims
- 5052US10588220B2Dry method of metallizing polymer thick film surfacesMOLEX LLC·Filed 2018·Granted Mar 10, 2020·0 cites·7 claims
Showing the top 50 of 75 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →