Inventor
CHISHOLM MICHAEL F
US11 patents
⚠️ This page may combine multiple inventors who share the name “CHISHOLM MICHAEL F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
8 patentsUS5536202AJul 16, 1996
Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
TEXAS INSTRUMENTS INC172 citations98
US5522965AJun 4, 1996
Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface
TEXAS INSTRUMENTS INC99 citations95
US5595527AJan 21, 1997
Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish
TEXAS INSTRUMENTS INC27 citations92
US5560802AOct 1, 1996
Selective CMP of in-situ deposited multilayer films to enhance nonplanar step height reduction
TEXAS INSTRUMENTS INC36 citations92
US6586839B2Jul 1, 2003
Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers
TEXAS INSTRUMENTS INC23 citations87
US11037816B2Jun 15, 2021
Transistor device with sinker contacts and methods for manufacturing the same
TEXAS INSTRUMENTS INC0 citations62
US5462882AOct 31, 1995
Masked radiant anneal diffusion method
TEXAS INSTRUMENTS INC4 citations61
US5420445AMay 30, 1995
Aluminum-masked and radiantly-annealed group II-IV diffused region
TEXAS INSTRUMENTS INC3 citations61
LSI LOGIC CORP
3 patentsUS6077783AJun 20, 2000
Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer
LSI LOGIC CORP72 citations96
US6235590B1May 22, 2001
Fabrication of differential gate oxide thicknesses on a single integrated circuit chip
LSI LOGIC CORP49 citations89
US6268224B1Jul 31, 2001
Method and apparatus for detecting an ion-implanted polishing endpoint layer within a semiconductor wafer
LSI LOGIC CORP6 citations62