Inventor
NASIRI STEVEN S
US47 patents
⚠️ This page may combine multiple inventors who share the name “NASIRI STEVEN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSENSE INC
26 patentsUS7907838B2Mar 15, 2011
Motion sensing and processing on mobile devices
INVENSENSE INC123 citations99
US7258011B2Aug 21, 2007
Multiple axis accelerometer
INVENSENSE INC151 citations99
US6892575B2May 17, 2005
X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
INVENSENSE INC172 citations99
US8513747B1Aug 20, 2013
Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
INVENSENSE INC44 citations98
US8351773B2Jan 8, 2013
Motion sensing and processing on mobile devices
INVENSENSE INC93 citations98
US8350346B1Jan 8, 2013
Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
INVENSENSE INC101 citations98
US7934423B2May 3, 2011
Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics
INVENSENSE INC53 citations98
US7621183B2Nov 24, 2009
X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
INVENSENSE INC66 citations98
US7442570B2Oct 28, 2008
Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
INVENSENSE INC220 citations98
US7250353B2Jul 31, 2007
Method and system of releasing a MEMS structure
INVENSENSE INC135 citations98
US7104129B2Sep 12, 2006
Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
INVENSENSE INC229 citations98
US6939473B2Sep 6, 2005
Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
INVENSENSE INC139 citations98
US7458263B2Dec 2, 2008
Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
INVENSENSE INC88 citations97
US7250112B2Jul 31, 2007
Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
INVENSENSE INC91 citations97
US7247246B2Jul 24, 2007
Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
INVENSENSE INC141 citations97
US8047075B2Nov 1, 2011
Vertically integrated 3-axis MEMS accelerometer with electronics
INVENSENSE INC69 citations96
US7796872B2Sep 14, 2010
Method and apparatus for producing a sharp image from a handheld device containing a gyroscope
INVENSENSE INC67 citations95
US9292102B2Mar 22, 2016
Controlling and accessing content using motion processing on mobile devices
INVENSENSE INC20 citations92
US8384134B2Feb 26, 2013
MEMS device including an electrical interconnect through a substrate
INVENSENSE INC11 citations84
US10288427B2May 14, 2019
Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
INVENSENSE INC1 citations73
US9811174B2Nov 7, 2017
Interfacing application programs and motion sensors of a device
INVENSENSE INC2 citations72
US9342154B2May 17, 2016
Interfacing application programs and motion sensors of a device
INVENSENSE INC4 citations72
US9846175B2Dec 19, 2017
MEMS rotation sensor with integrated electronics
INVENSENSE INC0 citations52
US9751752B2Sep 5, 2017
Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
INVENSENSE INC0 citations51
US9533880B2Jan 3, 2017
Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
INVENSENSE INC0 citations51
US9139428B2Sep 22, 2015
Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
INVENSENSE INC0 citations51
NASIRI STEVEN S
9 patentsUS8250921B2Aug 28, 2012
Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
NASIRI STEVEN S185 citations98
US8960002B2Feb 24, 2015
Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics
NASIRI STEVEN S41 citations97
US8952832B2Feb 10, 2015
Interfacing application programs and motion sensors of a device
NASIRI STEVEN S32 citations93
US8997564B2Apr 7, 2015
Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
NASIRI STEVEN S14 citations92
US8508039B1Aug 13, 2013
Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics
NASIRI STEVEN S26 citations92
US8462109B2Jun 11, 2013
Controlling and accessing content using motion processing on mobile devices
NASIRI STEVEN S30 citations92
US8084332B2Dec 27, 2011
Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom
NASIRI STEVEN S23 citations92
US8633049B2Jan 21, 2014
Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom
NASIRI STEVEN S8 citations83
US8170408B2May 1, 2012
Optical image stabilization in a digital still camera or handset
NASIRI STEVEN S9 citations81
MAXIM INTEGRATED PRODUCTS
5 patentsUS6351996B1Mar 5, 2002
Hermetic packaging for semiconductor pressure sensors
MAXIM INTEGRATED PRODUCTS144 citations99
US6229190B1May 8, 2001
Compensated semiconductor pressure sensor
MAXIM INTEGRATED PRODUCTS201 citations99
US6346742B1Feb 12, 2002
Chip-scale packaged pressure sensor
MAXIM INTEGRATED PRODUCTS97 citations98
US6255728B1Jul 3, 2001
Rigid encapsulation package for semiconductor devices
MAXIM INTEGRATED PRODUCTS114 citations98
US6006607ADec 28, 1999
Piezoresistive pressure sensor with sculpted diaphragm
MAXIM INTEGRATED PRODUCTS93 citations97