Inventor
BAJURI MOHD KAHAR
MY5 patents
Patents
5 patentsUS12205874B2Jan 21, 2025
Semiconductor package with wire bond joints
INFINEON TECHNOLOGIES AG0 citations54
US11842953B2Dec 12, 2023
Semiconductor package with wire bond joints and related methods of manufacturing
INFINEON TECHNOLOGIES AG0 citations54
US11211353B2Dec 28, 2021
Clips for semiconductor packages
INFINEON TECHNOLOGIES AG0 citations54
US10083899B2Sep 25, 2018
Semiconductor package with heat slug and rivet free die attach area
INFINEON TECHNOLOGIES AG1 citations45
US11705387B2Jul 18, 2023
Multi-layer interconnection ribbon
INFINEON TECHNOLOGIES AG0 citations37