Inventor

PURUSHOTHAMAN SAMPATH

US187 patents

⚠️ This page may combine multiple inventors who share the name “PURUSHOTHAMAN SAMPATH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PURUSHOTHAMAN SAMPATH

IBM

Very low effective dielectric constant interconnect structures and methods for fabricating the same

Method for forming a porous dielectric material layer in a semiconductor device and device formed

Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material

Method for improving performance of organic semiconductors in bottom electrode structure

Sputter deposition of hydrogenated amorphous carbon film and applications thereof

Interconnect structure having improved metallization

Layer transfer process and functionally enhanced integrated circuits produced thereby

Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby

Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby

High density chip carrier with integrated passive devices

Very low effective dielectric constant interconnect Structures and methods for fabricating the same

High density chip carrier with integrated passive devices

Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same

Structure employing electrically conductive adhesives

High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications

Flip-Chip interconnections using lead-free solders

Low temperature thin film transistor fabrication

Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same

Thermally conducting materials and applications for microelectronic packaging

Thin-film field-effect transistor with organic semiconductor requiring low operating voltages

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Diamond-like carbon films from a hydrocarbon helium plasma

Closed air gap interconnect structure

Multilayer interconnect structure containing air gaps and method for making

Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same

Thin-film field-effect transistor with organic semiconductor requiring low operating voltages

Device and methodology for reducing effective dielectric constant in semiconductor devices

Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics

Multilevel interconnect structure containing air gaps and method for making

Protective hardmask for producing interconnect structures

Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials

Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same

Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics

Method for improving performance of organic semiconductors in bottom electrode structure

Method for patterning sensitive organic thin films

Metal embedded passivation layer structure for microelectronic interconnect formation, customization and repair

Method for providing discharge protection or shielding

Dendritic powder materials for high conductivity paste applications

Composite comprising a metal substrate and a corrosion protecting layer

Methods of fabricating dendritic powder materials for high conductivity paste applications

Electronic package comprising a substrate and a semiconductor device bonded thereto

Composition containing a polymer and conductive filler and use thereof

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation

Structure, materials, and applications of ball grid array interconnections

Multi-level thin-film electronic packaging structure and related method

Alignment of liquid crystal layers

FAROOQ MUKTA G

3D integrated circuit device fabrication with precisely controllable substrate removal

(unassigned)

Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric

ANGELOPOULOS MARIE

Data protection by detection of intrusion into electronic assemblies