Method for providing discharge protection or shielding

Abstract

Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer to a dielectric substrate.

What is claimed is: 
     
       1. A method for providing electrostatic discharge protection by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polyanilines, substituted and unsubstituted polyazines, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, substituted and unsubstituted polyacetylenes, mixtures thereof, and copolymers thereof to a dielectric substrate. 
     
     
       2. The method of claim 1 wherein the amount of said conducting polymer is about 0.3 to about 90% by weight of the total of said polymeric matrix. 
     
     
       3. The method of claim 2 wherein the amount of conductive particles is about 40 to about 95% by weight based upon the total of said conducting polymer and said polymeric matrix. 
     
     
       4. The method of claim 2 wherein the amount of conducting particles is about 80 to about 90% by weight based upon the total of the conducting polymer and the polymeric matrix. 
     
     
       5. The method of claim 1 wherein said polymeric matrix comprises at least one polymer selected from the group consisting of polyepoxides, polyacrylates, polysiloxanes and polyimides, polymethacrylates, polyurethanes, polyolefins, and polyamides. 
     
     
       6. The method of claim 1 wherein said particles are carbon. 
     
     
       7. The method of claim 1 wherein said particles are precoated with said conducting polymer. 
     
     
       8. The method of claim 1 wherein said polymer is a polyaniline. 
     
     
       9. The method of claim 1 wherein said composition is in the form of a paste. 
     
     
       10. The method of claim 9 wherein said polyaniline is an alkoxy substituted polyaniline. 
     
     
       11. The method of claim 1 wherein said conducting polymer has conductivity of about 10 -10  ohm -1  cm -1  to about 10 6  ohm -1  cm -1 . 
     
     
       12. The method of claim 1 wherein said conducting polymer is unsubstituted. 
     
     
       13. The method of claim 1 wherein said conducting polymer is substituted with at least one member selected from the group consisting of alkyl, aryl, alkoxy, aryloxy, alkaryl, aralkyl, Si and Ge. 
     
     
       14. The method of claim 13 wherein said member contains 1-12 carbon atoms. 
     
     
       15. The method of claim 1 wherein the amount of conductive particles is about 75 to about 95% by weight based upon the total of the conducting polymer and the polymeric matrix. 
     
     
       16. The method of claim 15 wherein the amount of the conducting polymer is about 0.5 to about 50% by weight of the total of the polymeric matrix. 
     
     
       17. The method of claim 15 wherein the amount of the conducting polymer is about 1 to about 10% by weight based upon the total weight of the polymeric matrix. 
     
     
       18. The method of claim 1 wherein the composition is obtained by separately admixing the conducting polymer and the conductive particles with the polymeric matrix. 
     
     
       19. A method of providing electromagnetic interference shielding by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polyanilines, substituted and unsubstituted polyazines, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, substituted and unsubstituted polyacetylenes, mixtures thereof, and copolymers thereof to a dielectric substrate. 
     
     
       20. The method of claim 19 wherein the amount of said conducting polymer is about 0.3 to about 90% by weight of the total of said polymeric matrix. 
     
     
       21. The method of claim 20 wherein the amount of conductive particles is about 40 to about 95% by weight based upon the total of said conducting polymer and said polymeric matrix. 
     
     
       22. The method of claim 20 wherein the amount of conducting particles is about 80 to about 90% by weight based upon the total of the conducting polymer and the polymeric matrix. 
     
     
       23. The method of claim 19 wherein said polymeric matrix comprises at least one polymer selected from the group consisting of polyepoxides, polyacrylates, polysiloxanes and polyimides, polymethacrylates, polyurethanes, polyolefins, and polyamides. 
     
     
       24. The method of claim 19 wherein said particles are carbon. 
     
     
       25. The method of claim 19 wherein said particles are precoated with said conducting polymer. 
     
     
       26. The method of claim 19 wherein said polymer is a polyaniline. 
     
     
       27. The method of claim 26 wherein said polyaniline is an alkoxy substituted polyaniline. 
     
     
       28. The method of claim 19 wherein said composition is in the form of a paste. 
     
     
       29. The method of claim 19 wherein said conducting polymer has conductivity of about 10 -10  ohm -1  cm -1  to about 10 6  ohm -1  cm -1 . 
     
     
       30. The method of claim 19 wherein said conducting polymer is unsubstituted. 
     
     
       31. The method of claim 19 wherein said conducting polymer is substituted with at least one member selected from the group consisting of alkyl, aryl, alkoxy, aryloxy, alkaryl, aralkyl, Si and Ge. 
     
     
       32. The method of claim 31 wherein said member contains 1-12 carbon atoms. 
     
     
       33. The method of claim 19 wherein the amount of conductive particles is about 75 to about 95% by weight based upon the total of the conducting polymer and the polymeric matrix. 
     
     
       34. The method of claim 33 wherein the amount of the conducting polymer is about 0.5 to about 50% by weight of the total of the polymeric matrix. 
     
     
       35. The method of claim 33 wherein the amount of the conducting polymer is about 1 to about 10% by weight based upon the total weight of the polymeric matrix. 
     
     
       36. The method of claim 19 wherein the composition is obtained by separately admixing the conducting polymer and the conductive particles with the polymeric matrix.