Inventor
LIU AI-SEN
TW29 patents
⚠️ This page may combine multiple inventors who share the name “LIU AI-SEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
14 patentsUS7176137B2Feb 13, 2007
Method for multiple spacer width control
TAIWAN SEMICONDUCTOR MFG101 citations98
US6972253B2Dec 6, 2005
Method for forming dielectric barrier layer in damascene structure
TAIWAN SEMICONDUCTOR MFG19 citations92
US6943077B2Sep 13, 2005
Selective spacer layer deposition method for forming spacers with different widths
TAIWAN SEMICONDUCTOR MFG24 citations92
US6895360B2May 17, 2005
Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination
TAIWAN SEMICONDUCTOR MFG19 citations84
US6746900B1Jun 8, 2004
Method for forming a semiconductor device having high-K gate dielectric material
TAIWAN SEMICONDUCTOR MFG17 citations84
US6955984B2Oct 18, 2005
Surface treatment of metal interconnect lines
TAIWAN SEMICONDUCTOR MFG12 citations81
US7271103B2Sep 18, 2007
Surface treated low-k dielectric as diffusion barrier for copper metallization
TAIWAN SEMICONDUCTOR MFG8 citations74
US7083495B2Aug 1, 2006
Advanced process control approach for Cu interconnect wiring sheet resistance control
TAIWAN SEMICONDUCTOR MFG9 citations74
US8053894B2Nov 8, 2011
Surface treatment of metal interconnect lines
TAIWAN SEMICONDUCTOR MFG3 citations62
US7338909B2Mar 4, 2008
Micro-etching method to replicate alignment marks for semiconductor wafer photolithography
TAIWAN SEMICONDUCTOR MFG5 citations58
US6948238B2Sep 27, 2005
Method for dissociating metals from metal compounds
TAIWAN SEMICONDUCTOR MFG0 citations52
US6884149B2Apr 26, 2005
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
TAIWAN SEMICONDUCTOR MFG0 citations50
US6729935B2May 4, 2004
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
TAIWAN SEMICONDUCTOR MFG0 citations50
US7011929B2Mar 14, 2006
Method for forming multiple spacer widths
TAIWAN SEMICONDUCTOR MFG0 citations42
INGENTEC CORP
8 patentsUS12487188B2Dec 2, 2025
Wafer defect analyzing device and wafer defect analyzing method
INGENTEC CORP0 citations60
US11508872B2Nov 22, 2022
Alignment module for transferring a magnetic light-emitting die and alignment method thereof
INGENTEC CORP1 citations60
US11769861B2Sep 26, 2023
Light-emitting diode packaging structure and method for fabricating the same
INGENTEC CORP0 citations50
US12593733B2Mar 31, 2026
Vertical light emitting diode die packaging method
INGENTEC CORP0 citations48
US12417964B2Sep 16, 2025
Via-filling method of through-glass via substrate
INGENTEC CORP0 citations48
US12418011B2Sep 16, 2025
Bonding and transferring method for die package structures
INGENTEC CORP0 citations48
US12489093B2Dec 2, 2025
Magnetic LED die transferring device and magnetic LED die transferring method
INGENTEC CORP0 citations45
US12150242B2Nov 19, 2024
LED circuit board structure and LED testing and packaging method
INGENTEC CORP0 citations44
EPISTAR CORP
3 patentsUS9520281B2Dec 13, 2016
Method of fabricating an optoelectronic device with a hollow component in epitaxial layer
EPISTAR CORP0 citations52
US9926488B2Mar 27, 2018
Phosphor
EPISTAR CORP0 citations49
US9583680B2Feb 28, 2017
Transparent conductive structure, device comprising the same, and the manufacturing method thereof
EPISTAR CORP0 citations49