Inventor
TOLLES ROBERT D
US46 patents
⚠️ This page may combine multiple inventors who share the name “TOLLES ROBERT D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
41 patentsUS6524164B1Feb 25, 2003
Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC146 citations99
US5804507ASep 8, 1998
Radially oscillating carousel processing system for chemical mechanical polishing
APPLIED MATERIALS INC243 citations99
US5738574AApr 14, 1998
Continuous processing system for chemical mechanical polishing
APPLIED MATERIALS INC797 citations99
US5599423AFeb 4, 1997
Apparatus and method for simulating and optimizing a chemical mechanical polishing system
APPLIED MATERIALS INC153 citations99
US6454630B1Sep 24, 2002
Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
APPLIED MATERIALS INC109 citations98
US6217426B1Apr 17, 2001
CMP polishing pad
APPLIED MATERIALS INC83 citations97
US7614939B2Nov 10, 2009
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
APPLIED MATERIALS INC39 citations96
US6575825B2Jun 10, 2003
CMP polishing pad
APPLIED MATERIALS INC49 citations96
US6348124B1Feb 19, 2002
Delivery of polishing agents in a wafer processing system
APPLIED MATERIALS INC89 citations96
US6290589B1Sep 18, 2001
Polishing pad with a partial adhesive coating
APPLIED MATERIALS INC43 citations96
US6126517AOct 3, 2000
System for chemical mechanical polishing having multiple polishing stations
APPLIED MATERIALS INC63 citations96
US6080046AJun 27, 2000
Underwater wafer storage and wafer picking for chemical mechanical polishing
APPLIED MATERIALS INC49 citations96
US6527624B1Mar 4, 2003
Carrier head for providing a polishing slurry
APPLIED MATERIALS INC54 citations95
US6220942B1Apr 24, 2001
CMP platen with patterned surface
APPLIED MATERIALS INC73 citations95
US5899801AMay 4, 1999
Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system
APPLIED MATERIALS INC65 citations95
US6036587AMar 14, 2000
Carrier head with layer of conformable material for a chemical mechanical polishing system
APPLIED MATERIALS INC84 citations94
US7255632B2Aug 14, 2007
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
APPLIED MATERIALS INC13 citations93
US7097544B1Aug 29, 2006
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
APPLIED MATERIALS INC18 citations93
US6974371B2Dec 13, 2005
Two part retaining ring
APPLIED MATERIALS INC31 citations93
US6896585B2May 24, 2005
Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC23 citations93
US6702651B2Mar 9, 2004
Method and apparatus for conditioning a polishing pad
APPLIED MATERIALS INC18 citations93
US6688957B2Feb 10, 2004
Substrate polishing article
APPLIED MATERIALS INC28 citations93
US6607428B2Aug 19, 2003
Material for use in carrier and polishing pads
APPLIED MATERIALS INC19 citations93
US6572446B1Jun 3, 2003
Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane
APPLIED MATERIALS INC46 citations93
US6533645B2Mar 18, 2003
Substrate polishing article
APPLIED MATERIALS INC35 citations93
US6299516B1Oct 9, 2001
Substrate polishing article
APPLIED MATERIALS INC47 citations93
US6592438B2Jul 15, 2003
CMP platen with patterned surface
APPLIED MATERIALS INC19 citations92
US6280297B1Aug 28, 2001
Apparatus and method for distribution of slurry in a chemical mechanical polishing system
APPLIED MATERIALS INC24 citations92
US6051499AApr 18, 2000
Apparatus and method for distribution of slurry in a chemical mechanical polishing system
APPLIED MATERIALS INC28 citations92
US6443823B1Sep 3, 2002
Carrier head with layer of conformable material for a chemical mechanical polishing system
APPLIED MATERIALS INC25 citations90
US7238090B2Jul 3, 2007
Polishing apparatus having a trough
APPLIED MATERIALS INC10 citations84
US6623341B2Sep 23, 2003
Substrate polishing apparatus
APPLIED MATERIALS INC16 citations84
US7189141B2Mar 13, 2007
Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC6 citations74
US10565701B2Feb 18, 2020
Color imaging for CMP monitoring
APPLIED MATERIALS INC3 citations73
US11772234B2Oct 3, 2023
Small batch polishing fluid delivery for CMP
APPLIED MATERIALS INC3 citations68
US11715193B2Aug 1, 2023
Color imaging for CMP monitoring
APPLIED MATERIALS INC0 citations62
US7165565B2Jan 23, 2007
Megasonic wafer cleaning tank with reflector for improved wafer edge cleaning
APPLIED MATERIALS INC3 citations58
US10800000B2Oct 13, 2020
Multi-layered nano-fibrous CMP pads
APPLIED MATERIALS INC0 citations52
US7677959B2Mar 16, 2010
Multilayer polishing pad and method of making
APPLIED MATERIALS INC0 citations52
US6716092B2Apr 6, 2004
Apparatus for making a polishing pad with a partial adhesive coating
APPLIED MATERIALS INC0 citations52
US10786885B2Sep 29, 2020
Thin plastic polishing article for CMP applications
APPLIED MATERIALS INC0 citations38