P

Inventor

SOTA YOSHIKI

JP27 patents
⚠️ This page may combine multiple inventors who share the name “SOTA YOSHIKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHARP KK

21 patents
US5874784AFeb 23, 1999

Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor

SHARP KK289 citations99
US6100594AAug 8, 2000

Semiconductor device and method of manufacturing the same

SHARP KK290 citations98
US6181002B1Jan 30, 2001

Semiconductor device having a plurality of semiconductor chips

SHARP KK288 citations97
US6979905B2Dec 27, 2005

Semiconductor device

SHARP KK79 citations96
US6229217B1May 8, 2001

Semiconductor device and method of manufacturing the same

SHARP KK89 citations96
US6198165B1Mar 6, 2001

Semiconductor device

SHARP KK92 citations96
US6352879B1Mar 5, 2002

Semiconductor device and method of manufacturing the same

SHARP KK62 citations95
US6285086B1Sep 4, 2001

Semiconductor device and substrate for semiconductor device

SHARP KK55 citations95
US7876572B2Jan 25, 2011

Wiring board and semiconductor apparatus

SHARP KK41 citations92
US6545367B2Apr 8, 2003

Semiconductor package substrate, semiconductor package

SHARP KK21 citations92
US6403895B1Jun 11, 2002

Wiring substance and semiconductor

SHARP KK29 citations92
US6265783B1Jul 24, 2001

Resin overmolded type semiconductor device

SHARP KK48 citations92
US6250606B1Jun 26, 2001

Substrate for semiconductor device, semiconductor device and manufacturing method thereof

SHARP KK20 citations92
US6201707B1Mar 13, 2001

Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate

SHARP KK44 citations92
US5757080AMay 26, 1998

Resin-sealed semiconductor device

SHARP KK48 citations92
US5672912ASep 30, 1997

Resin-sealed type semiconductor device and method for manufacturing the same

SHARP KK50 citations92
US5646829AJul 8, 1997

Resin sealing type semiconductor device having fixed inner leads

SHARP KK50 citations92
USRE41826EOct 19, 2010

Semiconductor device

SHARP KK5 citations72
USRE38806EOct 4, 2005

Semiconductor device and method of manufacturing the same

SHARP KK6 citations72
US6731014B2May 4, 2004

Semiconductor package substrate, semiconductor package

SHARP KK4 citations63
US9537072B2Jan 3, 2017

Light emitting device, lead frame and resin cavity molding package

SHARP KK0 citations52

SOTA YOSHIKI

3 patents

HITACHI COMPANY LTD

1 patent

HITACHI CHEMICAL CO LTD

1 patent

OHTA MASAYUKI

1 patent