Inventor · disambiguated record
Byoungwook Jang
Also filed as: JANG BYOUNGWOOK
6 granted patents·4 pending applications·27 citations·filing 2010–2024
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0186US9252031B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·12 cites·21 claims
- 0281US9252095B2Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2013·Granted Feb 2, 2016·7 cites·28 claims
- 0379US8785251B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Jul 22, 2014·4 cites·25 claims
- 0477US8569895B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2012·Granted Oct 29, 2013·4 cites·18 claims
- 0558US2025118574A1Method of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0655US2024213174A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0755US2024145444A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0851US11710673B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0946US8193036B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2010·Granted Jun 5, 2012·0 cites·20 claims
- 1041US2016111347A1Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →