Inventor
LEE JAE SUK
KR76 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE SUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DONGBU ELECTRONICS CO LTD
24 patentsUS7468319B2Dec 23, 2008
Method for preventing a metal corrosion in a semiconductor device
DONGBU ELECTRONICS CO LTD181 citations99
US6790767B2Sep 14, 2004
Method for formation of copper diffusion barrier film using aluminum
DONGBU ELECTRONICS CO LTD29 citations93
US6348415B1Feb 19, 2002
Planarization method for semiconductor device
DONGBU ELECTRONICS CO LTD16 citations84
US7501706B2Mar 10, 2009
Semiconductor devices to reduce stress on a metal interconnect
DONGBU ELECTRONICS CO LTD5 citations74
US6649488B2Nov 18, 2003
Method of shallow trench isolation
DONGBU ELECTRONICS CO LTD9 citations71
US7687394B2Mar 30, 2010
Method for forming inter-layer dielectric of low dielectric constant and method for forming copper wiring using the same
DONGBU ELECTRONICS CO LTD2 citations63
US7605471B2Oct 20, 2009
Semiconductor devices and methods for manufacturing the same
DONGBU ELECTRONICS CO LTD2 citations63
US7416982B2Aug 26, 2008
Semiconductor devices and methods for manufacturing the same
DONGBU ELECTRONICS CO LTD3 citations63
US7402500B2Jul 22, 2008
Methods of forming shallow trench isolation structures in semiconductor devices
DONGBU ELECTRONICS CO LTD2 citations63
US7314814B2Jan 1, 2008
Semiconductor devices and methods of fabricating the same
DONGBU ELECTRONICS CO LTD5 citations63
US7186639B2Mar 6, 2007
Metal interconnection lines of semiconductor devices and methods of forming the same
DONGBU ELECTRONICS CO LTD4 citations63
US6657299B2Dec 2, 2003
Semiconductor with a stress reduction layer and manufacturing method therefor
DONGBU ELECTRONICS CO LTD4 citations63
US6716735B2Apr 6, 2004
Method for forming metal lines of semiconductor device
DONGBU ELECTRONICS CO LTD4 citations61
US7569495B2Aug 4, 2009
Semiconductor devices and methods of manufacturing the same
DONGBU ELECTRONICS CO LTD1 citations52
US7514793B2Apr 7, 2009
Metal interconnection lines of semiconductor devices and methods of forming the same
DONGBU ELECTRONICS CO LTD0 citations52
US7485555B2Feb 3, 2009
Methods for forming a P-type polysilicon layer in a semiconductor device
DONGBU ELECTRONICS CO LTD0 citations52
US7432203B2Oct 7, 2008
Methods for fabricating a metal layer pattern
DONGBU ELECTRONICS CO LTD0 citations52
US7407884B2Aug 5, 2008
Method for forming an aluminum contact
DONGBU ELECTRONICS CO LTD0 citations52
US7341942B2Mar 11, 2008
Method for forming metal line of semiconductor device
DONGBU ELECTRONICS CO LTD1 citations52
US7338855B2Mar 4, 2008
Method for fabricating semiconductor device
DONGBU ELECTRONICS CO LTD1 citations52
US7300862B2Nov 27, 2007
Method for manufacturing semiconductor device
DONGBU ELECTRONICS CO LTD0 citations52
US7223675B2May 29, 2007
Method of forming pre-metal dielectric layer
DONGBU ELECTRONICS CO LTD0 citations52
US7202184B2Apr 10, 2007
Method for fabricating semiconductor device
DONGBU ELECTRONICS CO LTD0 citations52
US7087520B2Aug 8, 2006
Method for fabricating metal wiring
DONGBU ELECTRONICS CO LTD0 citations52
KWANGJU INST SCI & TECH
6 patentsUS6545159B2Apr 8, 2003
Vinyl-phenyl pyridine monomers and polymers prepared therefrom
KWANGJU INST SCI & TECH18 citations90
US7368514B2May 6, 2008
Siloxane monomer containing trifluorovinylether group and sol-gel hybrid polymer prepared by using the same
KWANGJU INST SCI & TECH9 citations83
US6512076B2Jan 28, 2003
Poly (arylene ether sulfide) and poly (arylene ether sulfone) for optical device and method for preparing the same
KWANGJU INST SCI & TECH7 citations73
US6660821B2Dec 9, 2003
Vinyl-phenyl pyridine monomers and polymers prepared thereform
KWANGJU INST SCI & TECH9 citations71
US7173155B1Feb 6, 2007
Terphenyl dihalide monomers having sulfonate groups and process for preparing the same
KWANGJU INST SCI & TECH2 citations60
US6569978B2May 27, 2003
Anionic polymerization of functionalized styrene derivatives containing carbazole
KWANGJU INST SCI & TECH2 citations58
SAMSUNG ELECTRONICS CO LTD
6 patentsUS7327530B2Feb 5, 2008
Hard disk drive having disk damper and disk protector
SAMSUNG ELECTRONICS CO LTD14 citations84
US7283323B2Oct 16, 2007
Damping structure of a hard disk drive
SAMSUNG ELECTRONICS CO LTD7 citations74
US10581140B2Mar 3, 2020
Antenna module having metal frame antenna segment and electronic device including the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US10700422B2Jun 30, 2020
Portable device and near field communication chip
SAMSUNG ELECTRONICS CO LTD4 citations72
US10256526B2Apr 9, 2019
Near field communication antenna, near field communication device and mobile device having the same
SAMSUNG ELECTRONICS CO LTD3 citations69
US8018689B2Sep 13, 2011
Hard disk drive with thermal deformation prevention plate
SAMSUNG ELECTRONICS CO LTD2 citations63
DONGBUANAM SEMICONDUCTOR INC
4 patentsUS7030005B2Apr 18, 2006
Method of manufacturing semiconductor device
DONGBUANAM SEMICONDUCTOR INC18 citations84
US6916680B2Jul 12, 2005
Method for fabricating image sensor
DONGBUANAM SEMICONDUCTOR INC16 citations82
US7018907B2Mar 28, 2006
Methods for forming shallow trench isolation structures
DONGBUANAM SEMICONDUCTOR INC8 citations74
US6949475B2Sep 27, 2005
Methods to reduce stress on a metal interconnect
DONGBUANAM SEMICONDUCTOR INC8 citations74
DONGBU HITEK CO LTD
2 patentsUS7670948B2Mar 2, 2010
Semiconductor device having diffusion barriers and a method of preventing diffusion of copper in a metal interconnection of a semiconductor device
DONGBU HITEK CO LTD2 citations63
US7364968B2Apr 29, 2008
Capacitor in semiconductor device and manufacturing method
DONGBU HITEK CO LTD0 citations52
CAFE24 CORP
2 patentsKOREA INST SCI & TECH
1 patentSONY CORP
1 patentMOON BYEONG TAEK
1 patentLEE YOUNG-KI
1 patentSEAGATE TECHNOLOGY LLC
1 patentLEE JAE-SUK
1 patentShowing the top 50 of 76 patents by PatentIndex Score.