P

Inventor

LEE JAE SUK

KR76 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE SUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DONGBU ELECTRONICS CO LTD

24 patents
US7468319B2Dec 23, 2008

Method for preventing a metal corrosion in a semiconductor device

DONGBU ELECTRONICS CO LTD181 citations99
US6790767B2Sep 14, 2004

Method for formation of copper diffusion barrier film using aluminum

DONGBU ELECTRONICS CO LTD29 citations93
US6348415B1Feb 19, 2002

Planarization method for semiconductor device

DONGBU ELECTRONICS CO LTD16 citations84
US7501706B2Mar 10, 2009

Semiconductor devices to reduce stress on a metal interconnect

DONGBU ELECTRONICS CO LTD5 citations74
US6649488B2Nov 18, 2003

Method of shallow trench isolation

DONGBU ELECTRONICS CO LTD9 citations71
US7687394B2Mar 30, 2010

Method for forming inter-layer dielectric of low dielectric constant and method for forming copper wiring using the same

DONGBU ELECTRONICS CO LTD2 citations63
US7605471B2Oct 20, 2009

Semiconductor devices and methods for manufacturing the same

DONGBU ELECTRONICS CO LTD2 citations63
US7416982B2Aug 26, 2008

Semiconductor devices and methods for manufacturing the same

DONGBU ELECTRONICS CO LTD3 citations63
US7402500B2Jul 22, 2008

Methods of forming shallow trench isolation structures in semiconductor devices

DONGBU ELECTRONICS CO LTD2 citations63
US7314814B2Jan 1, 2008

Semiconductor devices and methods of fabricating the same

DONGBU ELECTRONICS CO LTD5 citations63
US7186639B2Mar 6, 2007

Metal interconnection lines of semiconductor devices and methods of forming the same

DONGBU ELECTRONICS CO LTD4 citations63
US6657299B2Dec 2, 2003

Semiconductor with a stress reduction layer and manufacturing method therefor

DONGBU ELECTRONICS CO LTD4 citations63
US6716735B2Apr 6, 2004

Method for forming metal lines of semiconductor device

DONGBU ELECTRONICS CO LTD4 citations61
US7569495B2Aug 4, 2009

Semiconductor devices and methods of manufacturing the same

DONGBU ELECTRONICS CO LTD1 citations52
US7514793B2Apr 7, 2009

Metal interconnection lines of semiconductor devices and methods of forming the same

DONGBU ELECTRONICS CO LTD0 citations52
US7485555B2Feb 3, 2009

Methods for forming a P-type polysilicon layer in a semiconductor device

DONGBU ELECTRONICS CO LTD0 citations52
US7432203B2Oct 7, 2008

Methods for fabricating a metal layer pattern

DONGBU ELECTRONICS CO LTD0 citations52
US7407884B2Aug 5, 2008

Method for forming an aluminum contact

DONGBU ELECTRONICS CO LTD0 citations52
US7341942B2Mar 11, 2008

Method for forming metal line of semiconductor device

DONGBU ELECTRONICS CO LTD1 citations52
US7338855B2Mar 4, 2008

Method for fabricating semiconductor device

DONGBU ELECTRONICS CO LTD1 citations52
US7300862B2Nov 27, 2007

Method for manufacturing semiconductor device

DONGBU ELECTRONICS CO LTD0 citations52
US7223675B2May 29, 2007

Method of forming pre-metal dielectric layer

DONGBU ELECTRONICS CO LTD0 citations52
US7202184B2Apr 10, 2007

Method for fabricating semiconductor device

DONGBU ELECTRONICS CO LTD0 citations52
US7087520B2Aug 8, 2006

Method for fabricating metal wiring

DONGBU ELECTRONICS CO LTD0 citations52

KWANGJU INST SCI & TECH

6 patents

SAMSUNG ELECTRONICS CO LTD

6 patents

DONGBUANAM SEMICONDUCTOR INC

4 patents

DONGBU HITEK CO LTD

2 patents

CAFE24 CORP

2 patents

KOREA INST SCI & TECH

1 patent

SONY CORP

1 patent

MOON BYEONG TAEK

1 patent

LEE YOUNG-KI

1 patent

SEAGATE TECHNOLOGY LLC

1 patent

LEE JAE-SUK

1 patent

Showing the top 50 of 76 patents by PatentIndex Score.