Inventor · disambiguated record
Kuei-Wei Chen
Also filed as: CHEN KUEI-WEI
7 granted patents·5 pending applications·5 citations·filing 2014–2025
75Inventor score
Files withXINTEC INC12
Top patents by PatentIndex Score
12 records- 0189US11973095B2Method for forming chip package with second opening surrounding first opening having conductive structure thereinXINTEC INC·Filed 2022·Granted Apr 30, 2024·1 cites·19 claims
- 0279US11942563B1Manufacturing method of chip package and chip packageXINTEC INC·Filed 2023·Granted Mar 26, 2024·0 cites·10 claims
- 0378US11450697B2Chip package with substrate having first opening surrounded by second opening and method for forming the sameXINTEC INC·Filed 2019·Granted Sep 20, 2022·2 cites·13 claims
- 0471US11705368B2Manufacturing method of chip package and chip packageXINTEC INC·Filed 2021·Granted Jul 18, 2023·0 cites·4 claims
- 0568US9318461B2Wafer level array of chips and method thereofXINTEC INC·Filed 2014·Granted Apr 19, 2016·2 cites·23 claims
- 0663US11121031B2Manufacturing method of chip package and chip packageXINTEC INC·Filed 2019·Granted Sep 14, 2021·0 cites·8 claims
- 0756US2023369362A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 0852US2024178261A1Chip package and method for forming the sameXINTEC INC·Filed 2023·Application pending·0 cites
- 0945US11056427B2Chip packageXINTEC INC·Filed 2019·Granted Jul 6, 2021·0 cites·16 claims
- 1044US2025359385A1Chip package and method for forming the sameXINTEC INC·Filed 2025·Application pending·0 cites
- 1141US2025255020A1Chip package and manufacturing method thereofXINTEC INC·Filed 2025·Application pending·0 cites
- 1234US2017256496A1Chip package and method for forming the sameXINTEC INC·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →