Inventor
FRANKEL JASON L
US10 patents
⚠️ This page may combine multiple inventors who share the name “FRANKEL JASON L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS7806341B2Oct 5, 2010
Structure for implementing secure multichip modules for encryption applications
IBM16 citations92
US7281667B2Oct 16, 2007
Method and structure for implementing secure multichip modules for encryption applications
IBM18 citations92
US5831810ANov 3, 1998
Electronic component package with decoupling capacitors completely within die receiving cavity of substrate
IBM41 citations88
US7472836B2Jan 6, 2009
Method and structure for implementing secure multichip modules for encryption applications
IBM11 citations84
US10949600B2Mar 16, 2021
Semiconductor package floating metal checks
IBM0 citations60
US7096451B2Aug 22, 2006
Mesh plane generation and file storage
IBM5 citations52
US10375820B2Aug 6, 2019
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
IBM0 citations51
US9955567B2Apr 24, 2018
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
IBM1 citations51
US10423751B2Sep 24, 2019
Semiconductor package floating metal checks
IBM0 citations50