Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

Abstract

A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

What is claimed is: 
     
       1. A method of fabricating a multilayered ceramic package, comprising:
 receiving, by at least one computer system, an initial multilayered ceramic package design, wherein the initial multilayered ceramic package design comprises a plurality of signal layers, each signal layer having one or more signal lines, at least one mesh layer adjacent at least one signal layer of the plurality of signal layers, wherein the at least one mesh layer comprises a mesh of a plurality of interconnected mesh line segments referenced by connection to either voltage or ground, wherein each of the plurality of mesh line segments are set to a same width, and at least one via running through the at least one signal layer and the at least one reference mesh layer, wherein each of the plurality of mesh line segments is positioned at least a via clearance minimum distance from the at least one via; 
 maintaining, by the at least one computer system, a first selection of mesh line segments of the plurality of mesh line segments at a first width and adjusting a second selection of mesh line segments of the plurality of mesh line segments to a second width, wherein the second width is greater than the first width, wherein the second selection of mesh line segments of the second width are positioned to contain crosstalk introduced by a selection of signal lines in at least one of the plurality of signal layers, wherein each of the plurality of mesh line segments is positioned at least the via clearance minimum distance for the at least one via, to generate a modified multilayered ceramic package design with mesh wiring of varying widths; 
 removing, by the at least one computer system, at least one mesh line segment from among the first selection of mesh line segments in the initial multilayered ceramic package design, to generate the modified multilayered ceramic package design with mesh wiring of varying widths and at least one less mesh line segment than specified in the initial multilayered ceramic package design, to reduce the total metal fill for the plurality of mesh line segments to meet metal loading requirements for fabricating the at least one mesh layer; and 
 controlling fabrication, by the at least one computer system, of the multilayered ceramic package based on the modified multilayered ceramic package design. 
 
     
     
       2. The method of  claim 1 , further comprising:
 selecting, by the at least one computer system, the distance of the second width such that the total metal fill for the plurality of mesh line segments meets metal loading requirements for fabricating the at least one mesh layer. 
 
     
     
       3. The method of  claim 1 , further comprising:
 adjusting, by the at least one computer system, the coarseness of the plurality of mesh line segments to reduce the total metal fill for the plurality of mesh line segments to meet metal loading requirements for fabricating the at least one mesh layer. 
 
     
     
       4. The method of  claim 1 , wherein the plurality of mesh line segments are set to a same pitch. 
     
     
       5. The method of  claim 1 , further comprising:
 setting, by the at least one computer system, a third selection of mesh line segments of the plurality of mesh line segments set to a third width, wherein only one side of each line segment among the third selection of mesh line segments is widened on a side opposite the at least one via. 
 
     
     
       6. The method of  claim 1 , wherein a first via from among the at least one via is set to a first diameter with a first via clearance and a second via from among the at least one via is set to a second diameter with a second via clearance. 
     
     
       7. The method of  claim 1 , further comprising:
 identifying, by the at least one computer system, the selection of signal lines with signals likely to introduce cross talk with signals of other signal lines on other planes from among the plurality of signal planes; and 
 identifying, by the at least one computer system, the second selection of mesh line segments comprising at least one mesh line segment in the at least one mesh plane positioned to shadow the selection of signal lines.