Inventor
WALLING PAUL R
US15 patents
⚠️ This page may combine multiple inventors who share the name “WALLING PAUL R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS6037044AMar 14, 2000
Direct deposit thin film single/multi chip module
IBM68 citations95
US6261467B1Jul 17, 2001
Direct deposit thin film single/multi chip module
IBM26 citations91
US6528735B1Mar 4, 2003
Substrate design of a chip using a generic substrate design
IBM41 citations90
US5677847AOct 14, 1997
Method and apparatus for designing a module
IBM20 citations83
US10956649B2Mar 23, 2021
Semiconductor package metal shadowing checks
IBM0 citations61
US10949600B2Mar 16, 2021
Semiconductor package floating metal checks
IBM0 citations60
US7096451B2Aug 22, 2006
Mesh plane generation and file storage
IBM5 citations52
US10546096B2Jan 28, 2020
Semiconductor package via stack checking
IBM0 citations51
US10423752B2Sep 24, 2019
Semiconductor package metal shadowing checks
IBM0 citations51
US10375820B2Aug 6, 2019
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
IBM0 citations51
US9955567B2Apr 24, 2018
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
IBM1 citations51
US10423751B2Sep 24, 2019
Semiconductor package floating metal checks
IBM0 citations50
US7325213B2Jan 29, 2008
Nested design approach
IBM0 citations48