Inventor

WEEKLY ROGER D

US52 patents

⚠️ This page may combine multiple inventors who share the name “WEEKLY ROGER D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WEEKLY ROGER D

IBM

Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density

Method for detecting noise events in systems with time variable operating points

Routing for multilayer ceramic substrates to reduce excessive via depth

Design method and system for minimizing blind via current loops

Application of multiple voltage droop detection

Mitigate power supply noise response by throttling execution units based upon voltage sensing

Application of multiple voltage droop detection and instruction throttling instances with customized thresholds across a semiconductor chip

Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring

Triangular assignment of pins used for diagonal interconnections between diagonal chips in a multi-chip module

Statistical switched capacitor droop sensor for application in power distribution noise mitigation

Tracking thermal mini-cycle stress

Routing for multilayer ceramic substrates to reduce excessive via depth

Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density

System for designing substrates having reference plane voids with strip segments

Reference plane voids with strip segment for improving transmission line integrity over vias

Method and computer program product for designing power distribution system in a circuit

Triangular assignment of pins used for diagonal interconnections between diagonal chips in a multi-chip module

Implementing high-speed signaling via dedicated printed circuit-board media

Implementing high-speed signaling via dedicated printed circuit-board media

Electronic module power supply

Method for detecting noise events in systems with time variable operating points

Fabricating substrates having low inductance via arrangements

System DC Analysis Methodology

Auto-router performing simultaneous placement of signal and return paths

Ceramic package in which far end noise is reduced using capacitive cancellation by offset wiring

Apparatus for crack prevention in integrated circuit packages

Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chip

Electronic module power supply

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

Electronic module power supply

Electronic module power supply

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

Power delivery analysis and design

System and method for power domain optimization

WEEKLY ROGER D

Ball grid array with improved single-ended and differential signal performance

Ball grid array with improved single-ended and differential signal performance

Ball grid array with improved single-ended and differential signal performance

System and method for integrated circuit module tamperproof mode personalization

System and method for multi-application socket

CHUN SUNGJUN

Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density

Circuit manufacturing and design techniques for reference plane voids with strip segment

Circuit manufacturing and design techniques for reference plane voids with strip segment

Circuit manufacturing and design techniques for reference plane voids with strip segment

COLBERT JOHN L

Motherboard assembly for interconnecting and distributing signals and power

Motherboard assembly for interconnecting and distributing signals and power

CHOI JINWOO

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

CASEY JON A

Enhanced thermal management for improved module reliability

BASKA DOUGLAS A

Implementing high-speed signaling via dedicated printed circuit-board media

CHRISTO MICHAEL A

Method of attaching an electronic module power supply

CAHILL JOSEPH J

Structure for enhancing reference return current conduction