Inventor · disambiguated record
Hironori Nishimura
Also filed as: NISHIMURA HIRONORI
3 granted patents·2 pending applications·12 citations·filing 2009–2010
60Inventor score
Top patents by PatentIndex Score
5 records- 0183US8296961B2Polishing pad thickness measuring method and polishing pad thickness measuring deviceNAKAYOSHI YUICHI·Filed 2010·Granted Oct 30, 2012·9 cites·20 claims
- 0268US8728942B2Method for producing epitaxial silicon waferOGATA SHINICHI·Filed 2010·Granted May 20, 2014·3 cites·2 claims
- 0344US8992791B2Method of cleaning semiconductor wafer and semiconductor waferKOZASA KAZUAKI·Filed 2009·Granted Mar 31, 2015·0 cites·6 claims
- 0430US2011132255A1Method for producing epitaxial silicon waferSUMCO CORP·Filed 2010·Application pending·0 cites
- 0528US2012149177A1Method of producing epitaxial silicon waferNAKAYOSHI YUICHI·Filed 2010·Application pending·0 cites
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