Inventor · disambiguated record
Irina Vasilyeva
Also filed as: VASILYEVA IRINA · VASILYEVA IRINA V
28 granted patents·4 pending applications·436 citations·filing 1995–2025
95Inventor score
Top patents by PatentIndex Score
32 records- 0198US5733816AMethod for depositing a tungsten layer on siliconMICRON TECHNOLOGY INC·Filed 1995·Granted Mar 31, 1998·356 cites·19 claims
- 0293US10249819B2Methods of forming semiconductor structures including multi-portion linersMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 2, 2019·13 cites·19 claims
- 0391US11264395B1Vertical transistor, integrated circuitry, method of forming a vertical transistor, and method of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 1, 2022·2 cites·24 claims
- 0488US9299663B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 29, 2016·10 cites·17 claims
- 0586US9401474B2Methods of forming structuresMICRON TECHNOLOGY INC·Filed 2014·Granted Jul 26, 2016·6 cites·11 claims
- 0683US10665782B2Methods of forming semiconductor structures including multi-portion linersMICRON TECHNOLOGY INC·Filed 2018·Granted May 26, 2020·2 cites·18 claims
- 0782US7618874B1Methods of forming capacitorsMICRON TECHNOLOGY INC·Filed 2008·Granted Nov 17, 2009·8 cites·29 claims
- 0881US9034752B2Methods of exposing conductive vias of semiconductor devices and associated structuresLI HONGQI·Filed 2013·Granted May 19, 2015·4 cites·26 claims
- 0979US12432928B2Vertical transistor, integrated circuitry, method of forming a vertical transistor, and method of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 30, 2025·0 cites·22 claims
- 1079US2025191972A1Methods of exposing conductive vias of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1178US9761797B2Methods of forming structuresMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·2 cites·21 claims
- 1276US9741612B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 22, 2017·2 cites·13 claims
- 1375US6734051B2Plasma enhanced chemical vapor deposition methods of forming titanium silicide comprising layers over a plurality of semiconductor substratesMICRON TECHNOLOGY INC·Filed 2003·Granted May 11, 2004·11 cites·22 claims
- 1474US11871582B2Vertical transistor, integrated circuitry, method of forming a vertical transistor, and method of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 9, 2024·0 cites·14 claims
- 1573US12237217B2Methods of exposing conductive Vias of semiconductor devices and related semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 25, 2025·0 cites·15 claims
- 1672US6586285B1Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layersMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 1, 2003·9 cites·17 claims
- 1771US11050020B2Methods of forming devices including multi-portion linersMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 29, 2021·0 cites·20 claims
- 1871US10879462B2Devices including multi-portion linersMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 1970US10923478B2Reduction of roughness on a sidewall of an openingMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 16, 2021·1 cites·18 claims
- 2066US7393563B2Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layersMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 1, 2008·1 cites·27 claims
- 2164US11923272B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 5, 2024·0 cites·14 claims
- 2262US11335626B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·0 cites·29 claims
- 2360US10658580B2Semiconductor structures including multi-portion linersMICRON TECHNOLOGY INC·Filed 2017·Granted May 19, 2020·0 cites·24 claims
- 2459US7033642B2Plasma enhanced chemical vapor deposition method of forming a titanium silicide comprising layerMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 25, 2006·4 cites·39 claims
- 2558US6767823B2Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layersMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 27, 2004·4 cites·29 claims
- 2654US7396570B2Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layersMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 8, 2008·0 cites·30 claims
- 2752US8318578B2Method of forming capacitorsSHEA KEVIN·Filed 2009·Granted Nov 27, 2012·1 cites·27 claims
- 2851US2015145146A1Methods of exposing conductive vias of semiconductor devices and related semiconductor devicesMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 2950US2007164390A1Silicon nitride passivation layers having oxidized interfaceVASILYEVA IRINA V·Filed 2006·Application pending·0 cites
- 3047US2007012661A1Silicon nitride passivation layers having oxidized interfaceVASILYEVA IRINA V·Filed 2005·Application pending·0 cites
- 3142US10163655B2Through substrate via liner densificationMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 25, 2018·0 cites·22 claims
- 3242US6730355B2Chemical vapor deposition method of forming a material over at least two substratesMICRON TECHNOLOGY INC·Filed 2002·Granted May 4, 2004·0 cites·60 claims
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