Inventor

BHATTACHARYYA BIDYUT

US3 patents

⚠️ This page may combine multiple inventors who share the name “BHATTACHARYYA BIDYUT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

2 patents

US5488257AJan 30, 1996

Multilayer molded plastic package using mesic technology

INTEL CORP24 citations89

US5345363ASep 6, 1994

Method and apparatus of coupling a die to a lead frame with a tape automated bonded tape that has openings which expose portions of the tape leads

INTEL CORP2 citations59

NGK SPARK PLUG CO

1 patent

US5060049AOct 22, 1991

Multiple resistivity wiring apparatus

NGK SPARK PLUG CO6 citations67