Inventor

PAGAILA REZA ARGENTY

SG41 patents

⚠️ This page may combine multiple inventors who share the name “PAGAILA REZA ARGENTY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAGAILA REZA ARGENTY

PAGAILA REZA ARGENTY

Integrated circuit packaging system with a shield and method of manufacture thereof

Exposed interconnect for a package on package system

Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation

Integrated circuit packaging system with exposed vertical interconnects and method of manufacture thereof

Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof

Integrated circuit packaging system with formed under-fill and method of manufacture thereof

Integrated circuit packaging system with shielded package and method of manufacture thereof

RDL patterning with package on package system

Integrated circuit packaging system and method of manufacture thereof

Package system with a shielded inverted internal stacking module and method of manufacture thereof

Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof

Integrated circuit packaging system with dual side connection and method of manufacture thereof

Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof

Exposed interconnect for a package on package system

Integrated circuit packaging system having planar interconnect and method for manufacture thereof

Integrated circuit packaging system with heat shield and method of manufacture thereof

Integrated circuit packaging system and method of manufacture thereof

STATS CHIPPAC LTD

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Integrated circuit packaging system with stacked die and method of manufacture thereof

Triple tier package on package system

Integrated circuit package system with conformal shielding and method of manufacture thereof

Integrated circuit packaging system and method of manufacture thereof

Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof

Integrated circuit packaging system having planar interconnect

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof

Integrated circuit package system with adhesive segment spacer

DO BYUNG TAI

Integrated circuit packaging system with interconnect and method of manufacture thereof

Integrated circuit packaging system with lead encapsulation and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit package system with package stand-off and method of manufacture thereof

Integrated circuit packaging system with interposer and method of manufacture thereof

CHOW SENG GUAN

Integrated circuit package system with internal stacking module

Integrated circuit package system with internal stacking module

Circuit system with leads and method of manufacture thereof

HA JONG-WOO

Planar encapsulation and mold cavity package in package system

CAMACHO ZIGMUND RAMIREZ

Integrated circuit package system with concave terminal

KUAN HEAP HOE

Integrated circuit packaging system with support structure and method of manufacture thereof

STATS CHIPPAC PTE LTD

Integrated circuit packaging system and method of manufacture thereof

CHUA LINDA PEI EE

Integrated circuit packaging system with filled vias and method of manufacture thereof