Inventor · disambiguated record
Wei Jiang
Also filed as: JIANG WEI · JIANG WEI-LING
21 granted patents·15 pending applications·19 citations·filing 2011–2023
90Inventor score
Files withYIN HAIZHOU8CHANGXIN MEMORY TECH INC7BEIJING APOLLO DING RONG SOLAR TECH CO LTD6XIAMEN CHANGELIGHT CO LTD6INST OF MICROELECTRONICS CAS2
Top patents by PatentIndex Score
36 records- 0180US10043850B2HV-LED module having 3D light-emitting structure and manufacturing method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2016·Granted Aug 7, 2018·5 cites·15 claims
- 0276US10121656B2Buffer layers having composite structuresXIAMEN CHANGELIGHT CO LTD·Filed 2017·Granted Nov 6, 2018·2 cites·20 claims
- 0373US9653492B2Array substrate, manufacturing method of array substrate and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2013·Granted May 16, 2017·3 cites·7 claims
- 0473US8829642B2Semiconductor device and method for manufacturing the sameYIN HAIZHOU·Filed 2012·Granted Sep 9, 2014·3 cites·13 claims
- 0572US8530328B1Method for manufacturing semiconductor deviceYIN HAIZHOU·Filed 2012·Granted Sep 10, 2013·3 cites·6 claims
- 0666US8809134B2Semiconductor structure and method for manufacturing the sameYIN HAIZHOU·Filed 2012·Granted Aug 19, 2014·2 cites·13 claims
- 0765US12242258B2System and method for controlling non-product wafer, storage medium and electronic deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 4, 2025·0 cites·18 claims
- 0864US9830261B2Region descriptor management method and electronic apparatus thereofLITE ON TECHNOLOGY CORP·Filed 2015·Granted Nov 28, 2017·1 cites·12 claims
- 0961US2025003056A1Amorphous transparent conductive oxide films and methods of fabricating the sameCORNING INC·Filed 2022·Application pending·0 cites
- 1057US12334441B2Semiconductor device and semiconductor layout structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 17, 2025·0 cites·19 claims
- 1156US12400953B2Electro static discharge circuit and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Granted Aug 26, 2025·0 cites·14 claims
- 1256US2023395543A1Package structure and manufacturing method thereof, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1355US2024180015A1Method of manufacturing flexible transparent electrodes, flexible transparent electrodes manufactured by the method, and electrofield light emitting device having the flexible transparent electrodeUNIV INDUSTRY FOUNDATION UIF YONSEI UNIV·Filed 2023·Application pending·0 cites
- 1454US12437140B2Layout structure of clock tree circuitry and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1553US2023314357A1Structure for detecting crack and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 1652US10916422B2Buffer layers having composite structuresXIAMEN CHANGELIGHT CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·20 claims
- 1752US2018367094A1Photovoltaic module unit and photovoltaic deviceBEIJING APOLLO DING RONG SOLAR TECH CO LTD·Filed 2018·Application pending·0 cites
- 1852US2019238085A1Splicing mechanism for fixing photovoltaic module and photovoltaic curtain wallBEIJING APOLLO DING RONG SOLAR TECH CO LTD·Filed 2018·Application pending·0 cites
- 1948US12113531B2Layout structure and method for fabricating sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Oct 8, 2024·0 cites·18 claims
- 2046US9343530B2Method for manufacturing fin structure of finFETINST OF MICROELECTRONICS CAS·Filed 2012·Granted May 17, 2016·0 cites·9 claims
- 2146US2019097573A1Back-hang mounting assembly of thin film photovoltaic moduleBEIJING APOLLO DING RONG SOLAR TECH CO LTD·Filed 2018·Application pending·0 cites
- 2246US2019097570A1Back-hang mounting assembly of thin film photovoltaic moduleBEIJING APOLLO DING RONG SOLAR TECH CO LTD·Filed 2018·Application pending·0 cites
- 2344US11474011B2Bending test apparatus and method for flexible sheet materialUNIV SOOCHOW·Filed 2018·Granted Oct 18, 2022·0 cites·8 claims
- 2444US9147762B2Semiconductor device and method for manufacturing the sameYIN HAIZHOU·Filed 2012·Granted Sep 29, 2015·0 cites·9 claims
- 2544US2020001592A1Light transmission processing system and method for solar chip moduleBEIJING APOLLO DING RONG SOLAR TECH CO LTD·Filed 2018·Application pending·0 cites
- 2642US10333028B2Light-emitting diode chips with enhanced brightnessXIAMEN CHANGELIGHT CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·13 claims
- 2742US2015287808A1Semiconductor structure and method for manufacturing the sameINST OF MICROELECTRONICS CAS·Filed 2012·Application pending·0 cites
- 2841US10937926B2Light-emitting diodes with buffer layersXIAMEN CHANGELIGHT CO LTD·Filed 2017·Granted Mar 2, 2021·0 cites·10 claims
- 2941US2013256810A1Semiconductor Device and Method for Manufacturing the SameYIN HAIZHOU·Filed 2012·Application pending·0 cites
- 3040US2013260532A1Method for Manufacturing Semiconductor DeviceYIN HAIZHOU·Filed 2012·Application pending·0 cites
- 3139US8889554B2Semiconductor structure and method for manufacturing the sameYIN HAIZHOU·Filed 2011·Granted Nov 18, 2014·0 cites·5 claims
- 3239US2021220877A1Fully-automatic device for detecting substrate size, substrate detection line and detecting method thereofBEIJING APOLLO DING RONG SOLAR TECH CO LTD·Filed 2017·Application pending·0 cites
- 3337US11688698B2Trench insulated gate bipolar transistor packaging structure and method for manufacturing the trench insulated gate bipolar transistorGREE ELECTRIC APPLIANCES INC ZHUHAI·Filed 2019·Granted Jun 27, 2023·0 cites·10 claims
- 3437US2013240990A1Semiconductor structure and method for manufacturing the sameYIN HAIZHOU·Filed 2011·Application pending·0 cites
- 3534US11353495B2Fabrication variation analysis method of silicon Mach-Zehnder electro- optic modulatorNANJING UNIVERSITY OF TECHNOLOGY·Filed 2020·Granted Jun 7, 2022·0 cites·7 claims
- 3634US2017256403A1Method of Manufacturing Buffer Layers Having Composite StructuresXIAMEN CHANGELIGHT CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →