Inventor

PORWOL DANIEL

DE17 patents

⚠️ This page may combine multiple inventors who share the name “PORWOL DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PORWOL DANIEL

INFINEON TECHNOLOGIES AG

Reconfigured wafer alignment

Method for fabricating a semiconductor chip panel

Chip package and a method of producing the same

Method for fabricating a semiconductor chip panel

Bonded system and a method for adhesively bonding a hygroscopic material

Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component

Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer

Method for fabricating a semiconductor chip panel

Temporary mechanical stabilization of semiconductor cavities

Method for handling a product substrate and a bonded substrate system

Method for handling a product substrate, a bonded substrate system and a temporary adhesive

Device and method for debonding a structure from a main surface region of a carrier

Infrared emitter arrangement and method for producing an infrared emitter arrangement

BAUER MICHAEL

Electronic device and method of manufacturing same

Method for fabricating a semiconductor device

BRUNNBAUER MARKUS

Mold apparatus and method

Mold method