Inventor
CHEN WEI-MING
TW83 patents
⚠️ This page may combine multiple inventors who share the name “CHEN WEI-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS9818720B2Nov 14, 2017
Structure and formation method for chip package
TAIWAN SEMICONDUCTOR MFG CO LTD53 citations98
US9806058B2Oct 31, 2017
Chip package having die structures of different heights and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD60 citations98
US10163856B2Dec 25, 2018
Stacked integrated circuit structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US9899305B1Feb 20, 2018
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD30 citations90
US10964667B2Mar 30, 2021
Stacked integrated circuit structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10170457B2Jan 1, 2019
COWOS structures and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9741669B2Aug 22, 2017
Forming large chips through stitching
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10985137B2Apr 20, 2021
Stacked integrated circuit structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9698115B2Jul 4, 2017
Three-dimensional chip stack and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12530516B2Jan 20, 2026
Method and non-transitory computer-readable medium for arranging components within a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12265773B2Apr 1, 2025
Method and apparatus for electromigration evaluation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11861285B2Jan 2, 2024
Electromigration evaluation methodology with consideration of current distribution
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11675950B2Jun 13, 2023
Method and apparatus for electromigration evaluation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
6 patentsUS6225167B1May 1, 2001
Method of generating multiple oxide thicknesses by one oxidation step using NH3 nitridation followed by re-oxidation
TAIWAN SEMICONDUCTOR MFG83 citations98
US9355980B2May 31, 2016
Three-dimensional chip stack and method of forming the same
TAIWAN SEMICONDUCTOR MFG19 citations93
US7642176B2Jan 5, 2010
Electrical fuse structure and method
TAIWAN SEMICONDUCTOR MFG25 citations92
US7663237B2Feb 16, 2010
Butted contact structure
TAIWAN SEMICONDUCTOR MFG35 citations88
US7349234B2Mar 25, 2008
Magnetic memory array
TAIWAN SEMICONDUCTOR MFG9 citations84
US7173841B2Feb 6, 2007
Magnetic memory array
TAIWAN SEMICONDUCTOR MFG10 citations79
MOTOROLA INC
4 patentsUS5969383AOct 19, 1999
Split-gate memory device and method for accessing the same
MOTOROLA INC485 citations97
US5824584AOct 20, 1998
Method of making and accessing split gate memory device
MOTOROLA INC97 citations95
US5545574AAug 13, 1996
Process for forming a semiconductor device having a metal-semiconductor compound
MOTOROLA INC47 citations92
US6133093AOct 17, 2000
Method for forming an integrated circuit
MOTOROLA INC48 citations89
CHEN WEI-MING
3 patentsTSAI CHIA-LUN
3 patentsUS8823179B2Sep 2, 2014
Electronic device package and method for fabricating the same
TSAI CHIA-LUN5 citations83
US8541877B2Sep 24, 2013
Electronic device package and method for fabricating the same
TSAI CHIA-LUN9 citations83
US8319347B2Nov 27, 2012
Electronic device package and fabrication method thereof
TSAI CHIA-LUN3 citations62
ANALOG INTEGRATIONS CORP
2 patentsTECHWAY IND CO LTD
2 patentsXINTEC INC
2 patentsUNIV NATIONAL CHIAO TUNG
2 patentsQUANTA COMP INC
1 patentPERFECT CORP
1 patentHSIAO YING-HSIU
1 patentNAT HEALTH RESEARCH INSTITUTES
1 patentLU YU-LING
1 patentIND TECH RES INST
1 patentUNIV NAT TAIWAN
1 patentQUARK BIOSCIENCES TAIWAN INC
1 patentTAIPEI VETERANS GENERAL HOSPITAL
1 patentINTI TAIWAN INC
1 patentTAIWAN TEXTILE RES INST
1 patentWEN YING-NAN
1 patentAIROHA TECH CORP
1 patentShowing the top 50 of 83 patents by PatentIndex Score.