Inventor · disambiguated record
Nachiket R. Raravikar
Also filed as: RARAVIKAR NACHIKET · RARAVIKAR NACHIKET R · RARAVIKAR NACHIKET RAGHUNATH
51 granted patents·22 pending applications·440 citations·filing 2002–2024
98Inventor score
Top patents by PatentIndex Score
73 records- 0199US7465605B2In-situ functionalization of carbon nanotubesINTEL CORP·Filed 2005·Granted Dec 16, 2008·66 cites·12 claims
- 0298US7700943B2In-situ functionalization of carbon nanotubesINTEL CORP·Filed 2008·Granted Apr 20, 2010·70 cites·19 claims
- 0393US7534648B2Aligned nanotube bearing composite materialINTEL CORP·Filed 2006·Granted May 19, 2009·23 cites·10 claims
- 0492US8916981B2Epoxy-amine underfill materials for semiconductor packagesXIU YONGHAO·Filed 2013·Granted Dec 23, 2014·31 cites·25 claims
- 0592US7553681B2Carbon nanotube-based stress sensorINTEL CORP·Filed 2006·Granted Jun 30, 2009·26 cites·12 claims
- 0691US10461007B2Semiconductor package with electromagnetic interference shieldingINTEL CORP·Filed 2015·Granted Oct 29, 2019·8 cites·19 claims
- 0791US9028142B2Integrated microelectronic package temperature sensorRARAVIKAR NACHIKET R·Filed 2012·Granted May 12, 2015·13 cites·10 claims
- 0891US7666768B2Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductanceINTEL CORP·Filed 2006·Granted Feb 23, 2010·23 cites·8 claims
- 0990US7371674B2Nanostructure-based package interconnectINTEL CORP·Filed 2005·Granted May 13, 2008·29 cites·9 claims
- 1088US7799849B2Method to fabricate self-healing materialINTEL CORP·Filed 2007·Granted Sep 21, 2010·13 cites·15 claims
- 1187US7781260B2Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed therebyINTEL CORP·Filed 2007·Granted Aug 24, 2010·14 cites·14 claims
- 1287US7713858B2Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 11, 2010·11 cites·20 claims
- 1387US7618679B2Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of sameINTEL CORP·Filed 2007·Granted Nov 17, 2009·12 cites·9 claims
- 1484US9831206B2LPS solder paste based low cost fine pitch pop interconnect solutionsINTEL CORP·Filed 2014·Granted Nov 28, 2017·5 cites·8 claims
- 1583US10163810B2Electromagnetic interference shielding for system-in-package technologyINTEL CORP·Filed 2015·Granted Dec 25, 2018·4 cites·19 claims
- 1683US8344483B2Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing sameINTEL CORP·Filed 2010·Granted Jan 1, 2013·5 cites·10 claims
- 1781US9068067B2Flexible underfill compositions for enhanced reliabilityXU DINGYING·Filed 2010·Granted Jun 30, 2015·3 cites·10 claims
- 1880US8068328B2Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing sameRARAVIKAR NACHIKET R·Filed 2008·Granted Nov 29, 2011·8 cites·12 claims
- 1979US10586779B2LPS solder paste based low cost fine pitch pop interconnect solutionsINTEL CORP·Filed 2017·Granted Mar 10, 2020·1 cites·13 claims
- 2078US9953929B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2016·Granted Apr 24, 2018·2 cites·7 claims
- 2178US6782154B2Ultrafast all-optical switch using carbon nanotube polymer compositesRENSSELAER POLYTECH INST·Filed 2002·Granted Aug 24, 2004·41 cites·12 claims
- 2277US8174084B2Stress sensor for in-situ measurement of package-induced stress in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2006·Granted May 8, 2012·5 cites·10 claims
- 2376US8586393B2Stress sensor for in-situ measurement of package-induced stress in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2012·Granted Nov 19, 2013·3 cites·15 claims
- 2476US8133585B2Thermally and electrically conductive structure comprising a carbon nanotube and a carbon coating, and method of reducing a contact resistance of sameSHEKHAWAT LINDA A·Filed 2009·Granted Mar 13, 2012·4 cites·8 claims
- 2573US9214420B2Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing sameINTEL CORP·Filed 2012·Granted Dec 15, 2015·2 cites·10 claims
- 2673US8287996B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2009·Granted Oct 16, 2012·5 cites·11 claims
- 2770US10672626B2Method and materials for warpage thermal and interconnect solutionsINTEL CORP·Filed 2017·Granted Jun 2, 2020·1 cites·7 claims
- 2870US8409665B2Method for reducing contact resistance of a thermally and electrically conductive structure comprising carbon nanotubeSHEKHAWAT LINDA A·Filed 2012·Granted Apr 2, 2013·2 cites·3 claims
- 2969US11404349B2Multi-chip packages and sinterable paste for use with thermal interface materialsINTEL CORP·Filed 2016·Granted Aug 2, 2022·2 cites·11 claims
- 3068US9795038B2Electronic package design that facilitates shipping the electronic packageINTEL CORP·Filed 2014·Granted Oct 17, 2017·2 cites·10 claims
- 3168US8158968B2Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivities and structures formed therebyRARAVIKAR NACHIKET·Filed 2007·Granted Apr 17, 2012·3 cites·9 claims
- 3268US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 3366US2014231265A1Electronic Packages and Components Thereof Formed by Co-Deposited Carbon NanotubesWAKHARKAR VIJAY S·Filed 2014·Application pending·0 cites
- 3464US10224299B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2016·Granted Mar 5, 2019·1 cites·14 claims
- 3562US9458283B2Flexible underfill compositions for enhanced reliabilityINTEL CORP·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
- 3661US9159464B2Thermally and electrically conductive structure comprising a carbon nanotube, a graphite sheet and a metal layer; and method of reducing a contact resistance of sameINTEL CORP·Filed 2013·Granted Oct 13, 2015·0 cites·14 claims
- 3759US11652018B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 3858US10615128B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2018·Granted Apr 7, 2020·0 cites·17 claims
- 3955US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 4055US8558218B2Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivites and structures formed therebyRARAVIKAR NACHIKET·Filed 2012·Granted Oct 15, 2013·0 cites·6 claims
- 4155US8530890B2Aligned nanotube bearing composite materialRARAVIKAR NACHIKET·Filed 2012·Granted Sep 10, 2013·0 cites·4 claims
- 4254US10515914B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2019·Granted Dec 24, 2019·0 cites·19 claims
- 4354US9607964B2Method and materials for warpage thermal and interconnect solutionsKARHADE OMKAR G·Filed 2014·Granted Mar 28, 2017·0 cites·10 claims
- 4453US9669425B2Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of sameINTEL CORP·Filed 2015·Granted Jun 6, 2017·0 cites·14 claims
- 4552US11626551B1Bonding ultra-dense bump arrays using alignment bumpsTECTUS CORP·Filed 2021·Granted Apr 11, 2023·0 cites·22 claims
- 4651US8569108B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2012·Granted Oct 29, 2013·0 cites·7 claims
- 4751US2008131658A1Electronic packages and components thereof formed by co-deposited carbon nanotubesWAKHARKAR VIJAY·Filed 2006·Application pending·0 cites
- 4850US2009321922A1Self-healing thermal interface materials for semiconductor packagesSHANKAR RAVI·Filed 2008·Application pending·0 cites
- 4950US2014013855A1Deflection sensor for in-situ deflection measurement in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2013·Application pending·0 cites
- 5049US8222750B2Aligned nanotube bearing composite materialRARAVIKAR NACHIKET·Filed 2009·Granted Jul 17, 2012·2 cites·9 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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