Inventor
AUGENDRE EMMANUEL
FR31 patents
⚠️ This page may combine multiple inventors who share the name “AUGENDRE EMMANUEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMMISSARIAT ENERGIE ATOMIQUE
27 patentsUS10217849B2Feb 26, 2019
Method for making a semiconductor device with nanowire and aligned external and internal spacers
COMMISSARIAT ENERGIE ATOMIQUE7 citations83
US10600786B2Mar 24, 2020
Method for fabricating a device with a tensile-strained NMOS transistor and a uniaxial compression strained PMOS transistor
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US10431683B2Oct 1, 2019
Method for making a semiconductor device with a compressive stressed channel
COMMISSARIAT ENERGIE ATOMIQUE3 citations73
US10269930B2Apr 23, 2019
Method for producing a semiconductor device with self-aligned internal spacers
COMMISSARIAT ENERGIE ATOMIQUE6 citations73
US10217842B2Feb 26, 2019
Method for making a semiconductor device with self-aligned inner spacers
COMMISSARIAT ENERGIE ATOMIQUE3 citations73
US10141424B2Nov 27, 2018
Method of producing a channel structure formed from a plurality of strained semiconductor bars
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US10134875B2Nov 20, 2018
Method for fabricating a transistor having a vertical channel having nano layers
COMMISSARIAT ENERGIE ATOMIQUE5 citations73
US10109735B2Oct 23, 2018
Process for fabricating a field effect transistor having a coating gate
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US9853124B2Dec 26, 2017
Method for fabricating a nanowire semiconductor transistor having an auto-aligned gate and spacers
COMMISSARIAT ENERGIE ATOMIQUE4 citations72
US9704709B2Jul 11, 2017
Method for causing tensile strain in a semiconductor film
COMMISSARIAT ENERGIE ATOMIQUE2 citations72
US11469137B2Oct 11, 2022
Manufacturing process of an RF-SOI trapping layer substrate resulting from a crystalline transformation of a buried layer
COMMISSARIAT ENERGIE ATOMIQUE2 citations71
US11450755B2Sep 20, 2022
Electronic device including at least one nano-object
COMMISSARIAT ENERGIE ATOMIQUE0 citations62
US10818775B2Oct 27, 2020
Method for fabricating a field-effect transistor
COMMISSARIAT ENERGIE ATOMIQUE1 citations62
US11688811B2Jun 27, 2023
Transistor comprising a channel placed under shear strain and fabrication process
COMMISSARIAT ENERGIE ATOMIQUE0 citations61
US10978594B2Apr 13, 2021
Transistor comprising a channel placed under shear strain and fabrication process
COMMISSARIAT ENERGIE ATOMIQUE0 citations61
US12119258B2Oct 15, 2024
Semiconductor structure comprising a buried porous layer for RF applications
COMMISSARIAT ENERGIE ATOMIQUE0 citations57
US11848191B2Dec 19, 2023
RF substrate structure and method of production
COMMISSARIAT ENERGIE ATOMIQUE0 citations57
US10727320B2Jul 28, 2020
Method of manufacturing at least one field effect transistor having epitaxially grown electrodes
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US9536951B2Jan 3, 2017
FinFET transistor comprising portions of SiGe with a crystal orientation [111]
COMMISSARIAT ENERGIE ATOMIQUE1 citations51
US10665497B2May 26, 2020
Method of manufacturing a structure having one or several strained semiconducting zones that may for transistor channel regions
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US10256102B2Apr 9, 2019
Method for fabricating a field effect transistor having a surrounding grid
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US10147788B2Dec 4, 2018
Process for fabricating a field effect transistor having a coating gate
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US10096694B2Oct 9, 2018
Process for fabricating a vertical-channel nanolayer transistor
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US9917153B2Mar 13, 2018
Method for producing a microelectronic device
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US9997394B2Jun 12, 2018
Method for transferring a thin layer with supply of heat energy to a fragile zone via an inductive layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations40
US9853130B2Dec 26, 2017
Method of modifying the strain state of a semiconducting structure with stacked transistor channels
COMMISSARIAT ENERGIE ATOMIQUE0 citations40
US7879690B2Feb 1, 2011
Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns
COMMISSARIAT ENERGIE ATOMIQUE0 citations40