Inventor

RASH ROBERT

US51 patents

⚠️ This page may combine multiple inventors who share the name “RASH ROBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RASH ROBERT

LAM RES CORP

Integrated elastomeric lipseal and cup bottom for reducing wafer sticking

Edge flow element for electroplating apparatus

Apparatus and method for dynamic control of plated uniformity with the use of remote electric current

Multi-contact lipseals and associated electroplating methods

Methods and apparatuses for dynamically tunable wafer-edge electroplating

Integrated elastomeric lipseal and cup bottom for reducing wafer sticking

Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating

Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity

Apparatus and method for modulating azimuthal uniformity in electroplating

Methods and apparatus for flow isolation and focusing during electroplating

Bubble and foam solutions using a completely immersed air-free feedback flow control valve

Bubble and foam solutions using a completely immersed air-free feedback flow control valve

One-piece anode for tuning electroplating at an edge of a substrate

Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity

Debubbler component

Debubbler component

Debubbler component

Debubbler component

Debubbler component

Flow assisted dynamic seal for high-convection, continuous-rotation plating

Low angle membrane frame for an electroplating cell

High flow multi-way piston valve for deposition systems

Flow assisted dynamic seal for high-convection, continuous-rotation plating

NOVELLUS SYSTEMS INC

Electroplating flow shaping plate having offset spiral hole pattern

Cross flow manifold for electroplating apparatus

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Electroplating cup assembly

Closed contact electroplating cup assembly

Rapidly cleanable electroplating cup assembly

Cross flow manifold for electroplating apparatus

Electroplating apparatus for tailored uniformity profile

Apparatus for wetting pretreatment for enhanced damascene metal filling

Electroplating apparatus for tailored uniformity profile

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Methods and apparatus for wetting pretreatment for through resist metal plating

Electroplating apparatus for tailored uniformity profile

Automated cleaning of wafer plating assembly

Electrolyte loop with pressure regulation for separated anode chamber of electroplating system

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Methods and apparatuses for cleaning electroplating substrate holders

Methods and apparatus for wetting pretreatment for through resist metal plating

Methods and apparatus for wetting pretreatment for through resist metal plating

Electroplating apparatus for tailored uniformity profile

MAYER STEVEN T

Electroplating apparatus for tailored uniformity profile

Automated cleaning of wafer plating assembly

RASH ROBERT

Electrolyte loop with pressure regulation for separated anode chamber of electroplating system

GHONGADI SHANTINATH

Rapidly cleanable electroplating cup seal

PRABHAKAR VINAY

Wafer electroplating apparatus for reducing edge defects

FENG JINGBIN

Electroplating apparatus with vented electrolyte manifold