USD648289SActiveUtility

Electroplating flow shaping plate having offset spiral hole pattern

Assignee: NOVELLUS SYSTEMS INCPriority: Oct 21, 2010Filed: Oct 21, 2010Granted: Nov 8, 2011
Est. expiryOct 21, 2030(~4.3 yrs left)· nominal 20-yr term from priority
91
PatentIndex Score
51
Cited by
25
References
1
Claims

Claims

exact text as granted — not AI-modified
We claim the ornamental design for an electroplating flow shaping plate having offset spiral hole pattern, as shown and described.

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