Inventor · disambiguated record
Steven T. Mayer
Also filed as: MAYER STEVEN · MAYER STEVEN T
205 granted patents·20 pending applications·9,057 citations·filing 1975–2025
99Inventor score
Top patents by PatentIndex Score
225 records- 0199US8795480B2Control of electrolyte hydrodynamics for efficient mass transfer during electroplatingMAYER STEVEN T·Filed 2011·Granted Aug 5, 2014·48 cites·27 claims
- 0299US6527920B1Copper electroplating apparatusNOVELLUS SYSTEMS INC·Filed 2000·Granted Mar 4, 2003·251 cites·36 claims
- 0399US5529971ACarbon foams for energy storage devicesUNIV CALIFORNIA·Filed 1993·Granted Jun 25, 1996·149 cites·7 claims
- 0499US5096550AMethod and apparatus for spatially uniform electropolishing and electrolytic etchingUS ENERGY·Filed 1990·Granted Mar 17, 1992·413 cites·42 claims
- 0599US4314236AApparatus for producing a plurality of audio sound effectsATARI INC·Filed 1979·Granted Feb 2, 1982·123 cites·7 claims
- 0698US9834852B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2016·Granted Dec 5, 2017·13 cites·20 claims
- 0798US9464361B2Control of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2014·Granted Oct 11, 2016·12 cites·15 claims
- 0898US8262871B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN T·Filed 2009·Granted Sep 11, 2012·55 cites·21 claims
- 0998US7682498B1Rotationally asymmetric variable electrode correctionNOVELLUS SYSTEMS INC·Filed 2005·Granted Mar 23, 2010·39 cites·41 claims
- 1098US7622024B1High resistance ionic current sourceNOVELLUS SYSTEMS INC·Filed 2005·Granted Nov 24, 2009·83 cites·28 claims
- 1198US6964792B1Methods and apparatus for controlling electrolyte flow for uniform platingNOVELLUS SYSTEMS INC·Filed 2001·Granted Nov 15, 2005·121 cites·58 claims
- 1298US6890416B1Copper electroplating method and apparatusNOVELLUS SYSTEMS INC·Filed 2002·Granted May 10, 2005·92 cites·31 claims
- 1398US6755954B2Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elementsNOVELLUS SYSTEMS INC·Filed 2002·Granted Jun 29, 2004·140 cites·37 claims
- 1498US6402923B1Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping elementNOVELLUS SYSTEMS INC·Filed 2000·Granted Jun 11, 2002·163 cites·25 claims
- 1598US5783333ALithium nickel cobalt oxides for positive electrodesPOLYSTOR CORP·Filed 1996·Granted Jul 21, 1998·235 cites·12 claims
- 1697US10309024B2Electroplating apparatus and process for wafer level packagingNOVELLUS SYSTEMS INC·Filed 2018·Granted Jun 4, 2019·5 cites·19 claims
- 1797US9982357B2Electroplating apparatus and process for wafer level packagingNOVELLUS SYSTEMS INC·Filed 2016·Granted May 29, 2018·7 cites·12 claims
- 1897US9523155B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Dec 20, 2016·15 cites·22 claims
- 1997US9394620B2Control of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2014·Granted Jul 19, 2016·13 cites·16 claims
- 2097US8043958B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2010·Granted Oct 25, 2011·26 cites·13 claims
- 2197US7967969B2Method of electroplating using a high resistance ionic current sourceNOVELLUS SYSTEMS INC·Filed 2009·Granted Jun 28, 2011·50 cites·19 claims
- 2297US6919010B1Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correctionNOVELLUS SYSTEMS INC·Filed 2004·Granted Jul 19, 2005·66 cites·26 claims
- 2397US6773571B1Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sourcesNOVELLUS SYSTEMS INC·Filed 2002·Granted Aug 10, 2004·144 cites·45 claims
- 2497US6551487B1Methods and apparatus for controlled-angle wafer immersionNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·145 cites·16 claims
- 2597US6379842B1Mixed lithium manganese oxide and lithium nickel cobalt oxide positive electrodesPOLYSTOR CORP·Filed 1999·Granted Apr 30, 2002·143 cites·21 claims
- 2697US6309981B1Edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2000·Granted Oct 30, 2001·161 cites·45 claims
- 2797US6007947AMixed lithium manganese oxide and lithium nickel cobalt oxide positive electrodesPOLYSTOR CORP·Filed 1998·Granted Dec 28, 1999·157 cites·18 claims
- 2897US5789338AProcess for producing carbon foams for energy storage devicesUNIV CALIFORNIA·Filed 1996·Granted Aug 4, 1998·120 cites·14 claims
- 2997US5626977AComposite carbon foam electrodeUNIV CALIFORNIA·Filed 1995·Granted May 6, 1997·153 cites·9 claims
- 3097US5508341AOrganic aerogel microspheres and fabrication method thereforUNIV CALIFORNIA·Filed 1993·Granted Apr 16, 1996·177 cites·40 claims
- 3197US5420168AMethod of low pressure and/or evaporative drying of aerogelUNIV CALIFORNIA·Filed 1993·Granted May 30, 1995·208 cites·24 claims
- 3297US5260855ASupercapacitors based on carbon foamsKASCHMITTER JAMES L·Filed 1992·Granted Nov 9, 1993·255 cites·33 claims
- 3397US4116444AMethod for generating a plurality of moving objects on a video display screenATARI INC·Filed 1976·Granted Sep 26, 1978·88 cites·7 claims
- 3496US10094034B2Edge flow element for electroplating apparatusLAM RES CORP·Filed 2015·Granted Oct 9, 2018·11 cites·14 claims
- 3596US9746427B2Detection of plating on wafer holding apparatusNOVELLUS SYSTEMS INC·Filed 2014·Granted Aug 29, 2017·9 cites·21 claims
- 3696US9567685B2Apparatus and method for dynamic control of plated uniformity with the use of remote electric currentLAM RES CORP·Filed 2015·Granted Feb 14, 2017·11 cites·18 claims
- 3796US9404194B2Electroplating apparatus and process for wafer level packagingMAYER STEVEN T·Filed 2011·Granted Aug 2, 2016·10 cites·12 claims
- 3896US9309605B2Monitoring leveler concentrations in electroplating solutionsNOVELLUS SYSTEMS INC·Filed 2012·Granted Apr 12, 2016·7 cites·24 claims
- 3996US8158532B2Topography reduction and control by selective accelerator removalMAYER STEVEN T·Filed 2006·Granted Apr 17, 2012·44 cites·70 claims
- 4096US8128791B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2006·Granted Mar 6, 2012·39 cites·24 claims
- 4196US7605082B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2005·Granted Oct 20, 2009·36 cites·14 claims
- 4296US7070686B2Dynamically variable field shaping elementNOVELLUS SYSTEMS INC·Filed 2002·Granted Jul 4, 2006·76 cites·27 claims
- 4396US6800187B1Clamshell apparatus for electrochemically treating wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted Oct 5, 2004·168 cites·45 claims
- 4496US6551483B1Method for potential controlled electroplating of fine patterns on semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·110 cites·18 claims
- 4596US6333275B1Etchant mixing system for edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2000·Granted Dec 25, 2001·438 cites·24 claims
- 4696US4296476AData processing system with programmable graphics generatorATARI INC·Filed 1979·Granted Oct 20, 1981·118 cites·18 claims
- 4795US10662545B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2017·Granted May 26, 2020·4 cites·22 claims
- 4895US10364505B2Dynamic modulation of cross flow manifold during elecroplatingLAM RES CORP·Filed 2016·Granted Jul 30, 2019·7 cites·20 claims
- 4995US9449808B2Apparatus for advanced packaging applicationsNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 20, 2016·21 cites·23 claims
- 5095US9309604B2Method and apparatus for electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 12, 2016·18 cites·20 claims
Showing the top 50 of 225 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →