P

Inventor

MAYER STEVEN T

US201 patents
⚠️ This page may combine multiple inventors who share the name “MAYER STEVEN T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NOVELLUS SYSTEMS INC

26 patents
US6527920B1Mar 4, 2003

Copper electroplating apparatus

NOVELLUS SYSTEMS INC251 citations99
USD648289SNov 8, 2011

Electroplating flow shaping plate having offset spiral hole pattern

NOVELLUS SYSTEMS INC51 citations98
US7967969B2Jun 28, 2011

Method of electroplating using a high resistance ionic current source

NOVELLUS SYSTEMS INC50 citations98
US7622024B1Nov 24, 2009

High resistance ionic current source

NOVELLUS SYSTEMS INC83 citations98
US6964792B1Nov 15, 2005

Methods and apparatus for controlling electrolyte flow for uniform plating

NOVELLUS SYSTEMS INC121 citations98
US6890416B1May 10, 2005

Copper electroplating method and apparatus

NOVELLUS SYSTEMS INC92 citations98
US6793796B2Sep 21, 2004

Electroplating process for avoiding defects in metal features of integrated circuit devices

NOVELLUS SYSTEMS INC92 citations98
US6551487B1Apr 22, 2003

Methods and apparatus for controlled-angle wafer immersion

NOVELLUS SYSTEMS INC145 citations98
US6315883B1Nov 13, 2001

Electroplanarization of large and small damascene features using diffusion barriers and electropolishing

NOVELLUS SYSTEMS INC112 citations98
US7449098B1Nov 11, 2008

Method for planar electroplating

NOVELLUS SYSTEMS INC110 citations97
US7070686B2Jul 4, 2006

Dynamically variable field shaping element

NOVELLUS SYSTEMS INC76 citations97
US6800187B1Oct 5, 2004

Clamshell apparatus for electrochemically treating wafers

NOVELLUS SYSTEMS INC168 citations97
US6773571B1Aug 10, 2004

Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources

NOVELLUS SYSTEMS INC144 citations97
US6755946B1Jun 29, 2004

Clamshell apparatus with dynamic uniformity control

NOVELLUS SYSTEMS INC79 citations97
US6755954B2Jun 29, 2004

Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements

NOVELLUS SYSTEMS INC140 citations97
US6586342B1Jul 1, 2003

Edge bevel removal of copper from silicon wafers

NOVELLUS SYSTEMS INC76 citations97
US6551483B1Apr 22, 2003

Method for potential controlled electroplating of fine patterns on semiconductor wafers

NOVELLUS SYSTEMS INC110 citations97
US6309981B1Oct 30, 2001

Edge bevel removal of copper from silicon wafers

NOVELLUS SYSTEMS INC161 citations97
US7605082B1Oct 20, 2009

Capping before barrier-removal IC fabrication method

NOVELLUS SYSTEMS INC36 citations96
US7338908B1Mar 4, 2008

Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage

NOVELLUS SYSTEMS INC66 citations96
US6919010B1Jul 19, 2005

Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction

NOVELLUS SYSTEMS INC66 citations96
US6402923B1Jun 11, 2002

Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element

NOVELLUS SYSTEMS INC163 citations96
US6333275B1Dec 25, 2001

Etchant mixing system for edge bevel removal of copper from silicon wafers

NOVELLUS SYSTEMS INC438 citations96
US6946065B1Sep 20, 2005

Process for electroplating metal into microscopic recessed features

NOVELLUS SYSTEMS INC60 citations95
US6713122B1Mar 30, 2004

Methods and apparatus for airflow and heat management in electroless plating

NOVELLUS SYSTEMS INC44 citations95
US6562204B1May 13, 2003

Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers

NOVELLUS SYSTEMS INC47 citations95

UNIV CALIFORNIA

12 patents

POLYSTOR CORP

5 patents

MAYER STEVEN T

3 patents

ATARI INC

2 patents

US ENERGY

1 patent

KASCHMITTER JAMES L

1 patent

Showing the top 50 of 201 patents by PatentIndex Score.