Inventor
MATHEW VARUGHESE
US32 patents
⚠️ This page may combine multiple inventors who share the name “MATHEW VARUGHESE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
20 patentsUS7238601B2Jul 3, 2007
Semiconductor device having conductive spacers in sidewall regions and method for forming
FREESCALE SEMICONDUCTOR INC20 citations92
US6924232B2Aug 2, 2005
Semiconductor process and composition for forming a barrier material overlying copper
FREESCALE SEMICONDUCTOR INC36 citations92
US9093383B1Jul 28, 2015
Encapsulant for a semiconductor device
FREESCALE SEMICONDUCTOR INC7 citations84
US7422979B2Sep 9, 2008
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof
FREESCALE SEMICONDUCTOR INC14 citations82
US7993971B2Aug 9, 2011
Forming a 3-D semiconductor die structure with an intermetallic formation
FREESCALE SEMICONDUCTOR INC16 citations79
US8853867B2Oct 7, 2014
Encapsulant for a semiconductor device
FREESCALE SEMICONDUCTOR INC6 citations73
US9640466B1May 2, 2017
Packaged semiconductor device with a lead frame and method for forming
FREESCALE SEMICONDUCTOR INC5 citations65
US8003517B2Aug 23, 2011
Method for forming interconnects for 3-D applications
FREESCALE SEMICONDUCTOR INC2 citations61
US7807572B2Oct 5, 2010
Micropad formation for a semiconductor
FREESCALE SEMICONDUCTOR INC2 citations61
US7572723B2Aug 11, 2009
Micropad for bonding and a method therefor
FREESCALE SEMICONDUCTOR INC6 citations61
US7176133B2Feb 13, 2007
Controlled electroless plating
FREESCALE SEMICONDUCTOR INC3 citations59
US6803323B2Oct 12, 2004
Method of forming a component overlying a semiconductor substrate
FREESCALE SEMICONDUCTOR INC2 citations56
US10199339B2Feb 5, 2019
Semiconductor structure with sacrificial anode and method for forming
FREESCALE SEMICONDUCTOR INC0 citations52
US7410544B2Aug 12, 2008
Method for cleaning electroless process tank
FREESCALE SEMICONDUCTOR INC1 citations51
US9431313B1Aug 30, 2016
Integrated circuit carrier coating
FREESCALE SEMICONDUCTOR INC0 citations50
US7932175B2Apr 26, 2011
Method to form a via
FREESCALE SEMICONDUCTOR INC1 citations50
US7378339B2May 27, 2008
Barrier for use in 3-D integration of circuits
FREESCALE SEMICONDUCTOR INC0 citations50
US9508632B1Nov 29, 2016
Apparatus and methods for stackable packaging
FREESCALE SEMICONDUCTOR INC1 citations49
US7717060B2May 18, 2010
Controlled electroless plating
FREESCALE SEMICONDUCTOR INC1 citations48
US9978614B2May 22, 2018
Structure and method to minimize warpage of packaged semiconductor devices
FREESCALE SEMICONDUCTOR INC0 citations36
MATHEW VARUGHESE
6 patentsUS9012263B1Apr 21, 2015
Method for treating a bond pad of a package substrate
MATHEW VARUGHESE42 citations93
US8168468B2May 1, 2012
Method of making a semiconductor device including a bridgeable material
MATHEW VARUGHESE11 citations83
US10325876B2Jun 18, 2019
Surface finish for wirebonding
MATHEW VARUGHESE4 citations72
US8955388B2Feb 17, 2015
Mold compound compatibility test system and methods thereof
MATHEW VARUGHESE2 citations62
US8394713B2Mar 12, 2013
Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer
MATHEW VARUGHESE4 citations62
US9117756B2Aug 25, 2015
Encapsulant with corrosion inhibitor
MATHEW VARUGHESE0 citations51
CHOPIN SHEILA F
3 patentsUS8836110B2Sep 16, 2014
Heat spreader for use within a packaged semiconductor device
CHOPIN SHEILA F13 citations81
US9412709B2Aug 9, 2016
Semiconductor structure with sacrificial anode and passivation layer and method for forming
CHOPIN SHEILA F0 citations50
US9426884B2Aug 23, 2016
System and method for lead frame package degating
CHOPIN SHEILA F0 citations49