Inventor
BEYER SVEN
DE84 patents
⚠️ This page may combine multiple inventors who share the name “BEYER SVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
19 patentsUS10033383B1Jul 24, 2018
Programmable logic elements and methods of operating the same
GLOBALFOUNDRIES INC63 citations96
US9583640B1Feb 28, 2017
Method including a formation of a control gate of a nonvolatile memory cell and semiconductor structure
GLOBALFOUNDRIES INC30 citations93
US9793372B1Oct 17, 2017
Integrated circuit including a dummy gate structure and method for the formation thereof
GLOBALFOUNDRIES INC14 citations84
US9590118B1Mar 7, 2017
Wafer with SOI structure having a buried insulating multilayer structure and semiconductor device structure
GLOBALFOUNDRIES INC14 citations84
US8815741B1Aug 26, 2014
Method of forming a semiconductor structure including an implantation of ions into a layer of spacer material
GLOBALFOUNDRIES INC13 citations84
US8367495B2Feb 5, 2013
Method for forming CMOS transistors having metal-containing gate electrodes formed on a high-K gate dielectric material
GLOBALFOUNDRIES INC8 citations84
US8357604B2Jan 22, 2013
Work function adjustment in high-k gate stacks for devices of different threshold voltage
GLOBALFOUNDRIES INC19 citations84
US7943462B1May 17, 2011
Transistor including a high-K metal gate electrode structure formed prior to drain/source regions on the basis of a sacrificial carbon spacer
GLOBALFOUNDRIES INC14 citations84
US7799682B2Sep 21, 2010
Transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor
GLOBALFOUNDRIES INC12 citations84
US10163933B1Dec 25, 2018
Ferro-FET device with buried buffer/ferroelectric layer stack
GLOBALFOUNDRIES INC8 citations83
US8048792B2Nov 1, 2011
Superior fill conditions in a replacement gate approach by corner rounding prior to completely removing a placeholder material
GLOBALFOUNDRIES INC14 citations83
US9608112B2Mar 28, 2017
BULEX contacts in advanced FDSOI techniques
GLOBALFOUNDRIES INC12 citations82
US9548312B1Jan 17, 2017
Method including a formation of a control gate of a nonvolatile memory cell and semiconductor structure including a nonvolatile memory cell
GLOBALFOUNDRIES INC18 citations82
US10157996B2Dec 18, 2018
Methods for forming integrated circuits that include a dummy gate structure
GLOBALFOUNDRIES INC2 citations73
US8378432B2Feb 19, 2013
Maintaining integrity of a high-K gate stack by an offset spacer used to determine an offset of a strain-inducing semiconductor alloy
GLOBALFOUNDRIES INC5 citations73
US9698179B2Jul 4, 2017
Capacitor structure and method of forming a capacitor structure
GLOBALFOUNDRIES INC4 citations72
US10249633B2Apr 2, 2019
Flash memory device
GLOBALFOUNDRIES INC2 citations71
US9871050B1Jan 16, 2018
Flash memory device
GLOBALFOUNDRIES INC4 citations71
US9040405B2May 26, 2015
Gate electrode with a shrink spacer
GLOBALFOUNDRIES INC6 citations66
BEYER SVEN
7 patentsUS8791509B2Jul 29, 2014
Multiple gate transistor having homogenously silicided fin end portions
BEYER SVEN20 citations91
US8198152B2Jun 12, 2012
Transistors comprising high-k metal gate electrode structures and adapted channel semiconductor materials
BEYER SVEN10 citations84
US8283232B2Oct 9, 2012
Enhanced etch stop capability during patterning of silicon nitride including layer stacks by providing a chemically formed oxide layer during semiconductor processing
BEYER SVEN7 citations83
US8232188B2Jul 31, 2012
High-K metal gate electrode structures formed by separate removal of placeholder materials using a masking regime prior to gate patterning
BEYER SVEN8 citations82
US8318598B2Nov 27, 2012
Contacts and vias of a semiconductor device formed by a hard mask and double exposure
BEYER SVEN6 citations72
US8652956B2Feb 18, 2014
High-k metal gate electrode structures formed by separate removal of placeholder materials using a masking regime prior to gate patterning
BEYER SVEN4 citations71
US8536036B2Sep 17, 2013
Predoped semiconductor material for a high-K metal gate electrode structure of P- and N-channel transistors
BEYER SVEN3 citations63
SCHEIPER THILO
6 patentsUS8409942B2Apr 2, 2013
Replacement gate approach based on a reverse offset spacer applied prior to work function metal deposition
SCHEIPER THILO13 citations84
US8404550B2Mar 26, 2013
Performance enhancement in PFET transistors comprising high-k metal gate stack by increasing dopant confinement
SCHEIPER THILO7 citations84
US8241977B2Aug 14, 2012
Short channel transistor with reduced length variation by using amorphous electrode material during implantation
SCHEIPER THILO12 citations84
US9184095B2Nov 10, 2015
Contact bars with reduced fringing capacitance in a semiconductor device
SCHEIPER THILO6 citations73
US8916433B2Dec 23, 2014
Superior integrity of high-k metal gate stacks by capping STI regions
SCHEIPER THILO5 citations73
US8318564B2Nov 27, 2012
Performance enhancement in transistors comprising high-k metal gate stack by an early extension implantation
SCHEIPER THILO2 citations63
ADVANCED MICRO DEVICES INC
5 patentsUS7741167B2Jun 22, 2010
Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain
ADVANCED MICRO DEVICES INC26 citations92
US7608499B2Oct 27, 2009
Semiconductor structure comprising field effect transistors with stressed channel regions and method of forming the same
ADVANCED MICRO DEVICES INC23 citations92
US7547610B2Jun 16, 2009
Method of making a semiconductor device comprising isolation trenches inducing different types of strain
ADVANCED MICRO DEVICES INC11 citations83
US7504287B2Mar 17, 2009
Methods for fabricating an integrated circuit
ADVANCED MICRO DEVICES INC8 citations81
US8030148B2Oct 4, 2011
Structured strained substrate for forming strained transistors with reduced thickness of active layer
ADVANCED MICRO DEVICES INC4 citations63
HOENTSCHEL JAN
4 patentsUS8247275B2Aug 21, 2012
Strain engineering in three-dimensional transistors based on globally strained semiconductor base layers
HOENTSCHEL JAN24 citations92
US8748281B2Jun 10, 2014
Enhanced confinement of sensitive materials of a high-K metal gate electrode structure
HOENTSCHEL JAN5 citations73
US8669151B2Mar 11, 2014
High-K metal gate electrode structures formed at different process stages of a semiconductor device
HOENTSCHEL JAN6 citations73
US8329531B2Dec 11, 2012
Strain memorization in strained SOI substrates of semiconductor devices
HOENTSCHEL JAN6 citations73
GRIEBENOW UWE
3 patentsUS8455314B2Jun 4, 2013
Transistors comprising high-K metal gate electrode structures and embedded strain-inducing semiconductor alloys formed in a late stage
GRIEBENOW UWE5 citations84
US8338894B2Dec 25, 2012
Increased depth of drain and source regions in complementary transistors by forming a deep drain and source region prior to a cavity etch
GRIEBENOW UWE8 citations84
US8508008B2Aug 13, 2013
Optical signal transfer in a semiconductor device by using monolithic opto-electronic components
GRIEBENOW UWE10 citations80
CARTER RICHARD
3 patentsUS8653605B2Feb 18, 2014
Work function adjustment in a high-K gate electrode structure after transistor fabrication by using lanthanum
CARTER RICHARD6 citations83
US8198192B2Jun 12, 2012
Adjusting threshold voltage for sophisticated transistors by diffusing a gate dielectric cap layer material prior to gate dielectric stabilization
CARTER RICHARD6 citations83
US8445344B2May 21, 2013
Uniform high-k metal gate stacks by adjusting threshold voltage for sophisticated transistors by diffusing a metal species prior to gate patterning
CARTER RICHARD17 citations82
GLOBAL FOUNDRIES INC
1 patentONESPIN SOLUTIONS GMBH
1 patentGLOBALFOUNDRIES US INC
1 patentShowing the top 50 of 84 patents by PatentIndex Score.