Inventor
KOH GWAN-HYEOB
KR70 patents
⚠️ This page may combine multiple inventors who share the name “KOH GWAN-HYEOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
44 patentsUS7843718B2Nov 30, 2010
Non-volatile memory devices including stacked NAND-type resistive memory cell strings and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD238 citations99
US10157951B2Dec 18, 2018
CMOS image sensor (CIS) including MRAM (magnetic random access memory)
SAMSUNG ELECTRONICS CO LTD51 citations98
US7465675B2Dec 16, 2008
Method of forming a phase change memory device having a small area of contact
SAMSUNG ELECTRONICS CO LTD58 citations98
US6335233B1Jan 1, 2002
Method for fabricating MOS transistor
SAMSUNG ELECTRONICS CO LTD130 citations97
US9941333B2Apr 10, 2018
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD23 citations94
US9741764B1Aug 22, 2017
Memory device including ovonic threshold switch adjusting threshold voltage thereof
SAMSUNG ELECTRONICS CO LTD37 citations94
US9716129B1Jul 25, 2017
Memory device and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD25 citations93
US8036018B2Oct 11, 2011
Non-volatile memory devices including stacked NAND-type resistive memory cell strings
SAMSUNG ELECTRONICS CO LTD16 citations93
US6649490B1Nov 18, 2003
Methods for forming integrated circuit devices through selective etching of an insulation layer to increase the self-aligned contact area adjacent a semiconductor region and integrated circuit devices formed thereby
SAMSUNG ELECTRONICS CO LTD27 citations93
US7482616B2Jan 27, 2009
Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD39 citations92
US7411208B2Aug 12, 2008
Phase-change memory device having a barrier layer and manufacturing method
SAMSUNG ELECTRONICS CO LTD20 citations92
US6337282B2Jan 8, 2002
Method for forming a dielectric layer
SAMSUNG ELECTRONICS CO LTD27 citations90
US11482285B2Oct 25, 2022
Integrated circuit devices and methods of manufacturing same
SAMSUNG ELECTRONICS CO LTD6 citations85
US10263040B2Apr 16, 2019
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations84
US9991315B2Jun 5, 2018
Memory device including ovonic threshold switch adjusting threshold voltage thereof
SAMSUNG ELECTRONICS CO LTD7 citations84
US9887354B2Feb 6, 2018
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations84
US8026543B2Sep 27, 2011
Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US10062840B2Aug 28, 2018
Variable resistance memory devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations83
US9954030B2Apr 24, 2018
Semiconductor apparatus including magnetoresistive device
SAMSUNG ELECTRONICS CO LTD6 citations83
US10833250B2Nov 10, 2020
Magnetoresistive random access memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations82
US6870268B2Mar 22, 2005
Integrated circuit devices formed through selective etching of an insulation layer to increase the self-aligned contact area adjacent a semiconductor region
SAMSUNG ELECTRONICS CO LTD11 citations74
US6458680B2Oct 1, 2002
Method of fabricating contact pads of a semiconductor device
SAMSUNG ELECTRONICS CO LTD8 citations74
US6355547B1Mar 12, 2002
Method of forming a self-aligned contact pad for a semiconductor device
SAMSUNG ELECTRONICS CO LTD13 citations74
US11532782B2Dec 20, 2022
Semiconductor devices including spin-orbit torque line and contact plug
SAMSUNG ELECTRONICS CO LTD2 citations73
US11201192B2Dec 14, 2021
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations73
US11183538B2Nov 23, 2021
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10651236B2May 12, 2020
Semiconductor device including variable resistance memory device
SAMSUNG ELECTRONICS CO LTD2 citations73
US10636843B2Apr 28, 2020
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10566529B2Feb 18, 2020
Memory cell and memory device comprising selection device layer, middle electrode layer and variable resistance layer
SAMSUNG ELECTRONICS CO LTD3 citations73
US10388859B2Aug 20, 2019
Method of manufacturing a magnetoresistive random access memory device and method of manufacturing a semiconductor chip including the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10319784B2Jun 11, 2019
Semiconductor device including variable resistance memory device
SAMSUNG ELECTRONICS CO LTD2 citations73
US9805444B2Oct 31, 2017
Magnetic random access memory (MRAM)-based frame buffering apparatus, display driving apparatus and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US11158671B2Oct 26, 2021
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD2 citations72
US10566385B2Feb 18, 2020
Semiconductor apparatus including magnetoresistive device
SAMSUNG ELECTRONICS CO LTD5 citations72
US10497751B2Dec 3, 2019
Memory device and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US10062841B2Aug 28, 2018
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10818727B2Oct 27, 2020
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations71
US11659770B2May 23, 2023
Semiconductor device, magnetoresistive random access memory device, and semiconductor chip including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
USRE49478EMar 28, 2023
Image sensor including MRAM (magnetic random access memory)
SAMSUNG ELECTRONICS CO LTD1 citations62
US11349074B2May 31, 2022
Memory cell and memory device comprising selection device layer, middle electrode layer and variable resistance layer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11050016B2Jun 29, 2021
Semiconductor devices including spin-orbit torque line and contact plug
SAMSUNG ELECTRONICS CO LTD0 citations62
US10615341B2Apr 7, 2020
Semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10249820B2Apr 2, 2019
Semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10224086B2Mar 5, 2019
Memory device with temperature-dependent reading of a reference cell
SAMSUNG ELECTRONICS CO LTD1 citations62
KIM SUNG WOO
1 patentKOH GWAN-HYEOB
1 patentSUH KI-SEOK
1 patentBAK JUNG HOON
1 patentSEO BO YOUNG
1 patentSEO BO-YOUNG
1 patentShowing the top 50 of 70 patents by PatentIndex Score.