Inventor · disambiguated record
Masateru Fukuoka
Also filed as: FUKUOKA MASATERU
6 granted patents·12 pending applications·80 citations·filing 2000–2014
81Inventor score
Files withSEKISUI CHEMICAL CO LTD4FUKUOKA MASATERU3DISCO CORP1HATAI MUNEHIRO1SEKISUI CHEMICAL CO LD1
Top patents by PatentIndex Score
18 records- 0181US6608143B1Acrylic copolymer, acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive tape or sheet, and acrylic adhesive compositionSEKISUI CHEMICAL CO LD·Filed 2000·Granted Aug 19, 2003·34 cites·14 claims
- 0279US8353679B2Micropump deviceSEKISUI CHEMICAL CO LTD·Filed 2009·Granted Jan 15, 2013·7 cites·7 claims
- 0376US6939741B2IC chip manufacturing methodDISCO CORP·Filed 2003·Granted Sep 6, 2005·22 cites·6 claims
- 0472US7335578B2Method for manufacturing semiconductor chipSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Feb 26, 2008·17 cites·16 claims
- 0557US2006269715A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeSEKISUI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0654US8771612B2Photoresponsive gas-generating material, micropump and microfluid deviceFUKUOKA MASATERU·Filed 2009·Granted Jul 8, 2014·0 cites·12 claims
- 0753US8197773B2Micro fluid deviceFUKUOKA MASATERU·Filed 2009·Granted Jun 12, 2012·0 cites·17 claims
- 0849US2014134075A1Photoresponsive gas-generating material, micropump and microfluid deviceSEKISUI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0947US2005173051A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeFiled 2002·Application pending·0 cites
- 1042US2005054758A1Adhesive substance, adhesive product, and connected structureFiled 2002·Application pending·0 cites
- 1139US2004261943A1Adhesive material, method for unsticking adhesive material and bound structureFUKUOKA MASATERU·Filed 2002·Application pending·0 cites
- 1236US2007037364A1Method for manufacturing semiconductor chipSUGITA DAIHEI·Filed 2004·Application pending·0 cites
- 1336US2001044024A1Acrylic hot melt pressure-sensitive adhesive and protective film utilizing the sameFiled 2001·Application pending·0 cites
- 1435US2008314507A1Ic Chip Manufacturing MethodHATAI MUNEHIRO·Filed 2004·Application pending·0 cites
- 1535US2004106334A1Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement methodFiled 2001·Application pending·0 cites
- 1633US2004248382A1Pressure sensitive adhesive double coated tape and method for producing ic chip using itFiled 2002·Application pending·0 cites
- 1732US2010099240A1Dicing/die-bonding tape and method for manufacturing semiconductor chipWATANABE KOUJI·Filed 2007·Application pending·0 cites
- 1831US2013220533A1Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment methodTONEGAWA TORU·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →