Inventor

OTSUKA KANJI

JP65 patents

⚠️ This page may combine multiple inventors who share the name “OTSUKA KANJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OTSUKA KANJI

HITACHI LTD

Cooling apparatus of electronic device

Semiconductor device having leads for mounting to a surface of a printed circuit board

Semiconductor device and process for producing the same

Semiconductor device including an alpha-particle shield

LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted

Method for forming a silicide layer and barrier layer on a semiconductor device rear surface

Lsi cooling apparatus and computer cooling apparatus

Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals

Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals

Semiconductor device

Wire bonding apparatus

Semiconductor device and electronic apparatus using semiconductor device

Pin-grid array semiconductor device

Semiconductor device and method of producing the same

Integrated circuit package having heat sink bonded with resinous adhesive

Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein

Semiconductor device and process for producing the same, and lead frame used in said process

Semiconductor device having inner leads extending over a surface of a semiconductor pellet

Semiconductor integrated circuit device

Semi-conductor device

Semiconductor device and method of producing the same

Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein

Integrated circuit package with low-thermal expansion lead pieces

Process for forming wiring on substrate

Method for bonding an aluminum wire

Semiconductor device and method of mounting the semiconductor device

OTSUKA KANJI

Signal transmission apparatus and interconnection structure

Driver circuit, receiver circuit, and signal transmission bus system

Electronic device

Electronic device capable of greatly improving signal transmission speed in a bus wiring system

Electronic device

Signal transmission system

Electronic device

Semiconductor integrated circuit having switching transistors and varactors

ROHM CO LTD

Signal transmission system, and signal transmission line

Electronic circuit device

Wiring structure for transmission line having grooved conductors

SANYO ELECTRIC CO

Wiring substrate and process for producing the same

Wiring substrate

NISSAN CHEMICAL IND LTD

Polyimide resin from cyclobutane tetracarboxylic acid dianhydride

Process for producing an alcohol by hydroformylation

RENESAS TECH CORP

Circuit structure and semiconductor integrated circuit

Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture

FUJIKURA LTD

Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signals

VLSI TECHNOLOGY RES ASS

Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering

ELPIDA MEMORY INC

Semiconductor integrated circuit for high-speed, high-frequency signal transmission

TOSHIBA KK

Semiconductor circuit device having power and ground lines adapted for high-frequency operation

FUJITSU MICROELECTRONICS LTD

Electrostatic discharge protection circuit and terminating resistor circuit

FUJI XEROX CO LTD

Signal transmission circuit and signal transmission system with reduced reflection

NAT INST OF ADVANCED IND SCIEN

High-speed signal transmission system