Inventor · disambiguated record
Michael Raymond Weatherspoon
Also filed as: WEATHERSPOON MICHAEL · WEATHERSPOON MICHAEL R · WEATHERSPOON MICHAEL RAYMOND
29 granted patents·3 pending applications·73 citations·filing 2009–2016
95Inventor score
Files withHARRIS CORP21SHACKLETTE LAWRENCE WAYNE4WEATHERSPOON MICHAEL RAYMOND3REED THOMAS1RENDEK JR LOUIS JOSEPH1
Top patents by PatentIndex Score
32 records- 0189US8708576B2Electro-optical device having an elastomeric body and related methodsSHACKLETTE LAWRENCE WAYNE·Filed 2011·Granted Apr 29, 2014·15 cites·29 claims
- 0286US8693203B2Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devicesRENDEK JR LOUIS JOSEPH·Filed 2011·Granted Apr 8, 2014·9 cites·11 claims
- 0385US9478494B1Digital data device interconnectsHARRIS CORP·Filed 2015·Granted Oct 25, 2016·6 cites·19 claims
- 0483US9613770B2Processes for fabricating MEMS switches and other miniaturized devices having encapsulating enclosuresHARRIS CORP·Filed 2015·Granted Apr 4, 2017·2 cites·19 claims
- 0580US8137001B2Repeatable optical waveguide interconnection including an index matching elastomeric solid layer and related methodsSHACKLETTE LAWRENCE WAYNE·Filed 2009·Granted Mar 20, 2012·9 cites·19 claims
- 0678US9443789B2Embedded electronic packaging and associated methodsHARRIS CORP·Filed 2013·Granted Sep 13, 2016·3 cites·7 claims
- 0778US9293438B2Method for making electronic device with cover layer with openings and related devicesHARRIS CORP·Filed 2013·Granted Mar 22, 2016·4 cites·14 claims
- 0877US9691698B2Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devicesHARRIS CORP·Filed 2016·Granted Jun 27, 2017·2 cites·24 claims
- 0973US8867219B2Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devicesWEATHERSPOON MICHAEL·Filed 2011·Granted Oct 21, 2014·4 cites·17 claims
- 1072US9053874B2MEMS switches and other miniaturized devices having encapsulating enclosures, and processes for fabricating sameHARRIS CORP·Filed 2012·Granted Jun 9, 2015·2 cites·6 claims
- 1172US8559774B2Optical device having an elastomeric waveguide switch body and related methodsSHACKLETTE LAWRENCE WAYNE·Filed 2011·Granted Oct 15, 2013·4 cites·21 claims
- 1270US8904632B2Method to make a multilayer circuit board with intermetallic compound and related circuit boardsWEATHERSPOON MICHAEL RAYMOND·Filed 2011·Granted Dec 9, 2014·2 cites·16 claims
- 1368US9159485B2Method for making an electrical inductor and related inductor devicesHARRIS CORP·Filed 2013·Granted Oct 13, 2015·1 cites·8 claims
- 1468US8912641B1Low profile electronic package and associated methodsHARRIS CORP·Filed 2013·Granted Dec 16, 2014·2 cites·26 claims
- 1566US9142497B2Method for making electrical structure with air dielectric and related electrical structuresWEATHERSPOON MICHAEL RAYMOND·Filed 2011·Granted Sep 22, 2015·2 cites·15 claims
- 1665US8231281B2Repeatable optical waveguide interconnection including an index matching elastomeric solid layer providing core and cladding index of refraction matching and related methodsSHACKLETTE LAWRENCE WAYNE·Filed 2009·Granted Jul 31, 2012·3 cites·20 claims
- 1763US8877558B2Method for making electronic device with liquid crystal polymer and related devicesHARRIS CORP·Filed 2013·Granted Nov 4, 2014·2 cites·25 claims
- 1861US9437911B1Compliant high speed interconnectsHARRIS CORP·Filed 2015·Granted Sep 6, 2016·1 cites·19 claims
- 1957US10249453B2Switches for use in microelectromechanical and other systems, and processes for making sameHARRIS CORP·Filed 2015·Granted Apr 2, 2019·0 cites·10 claims
- 2056US9420687B2Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devicesHARRIS CORP·Filed 2014·Granted Aug 16, 2016·0 cites·18 claims
- 2155US9761398B2Switches for use in microelectromechanical and other systems, and processes for making sameHARRIS CORP·Filed 2015·Granted Sep 12, 2017·0 cites·18 claims
- 2254US9655236B2Method to make a multilayer circuit board with intermetallic compound and related circuit boardsHARRIS CORP·Filed 2014·Granted May 16, 2017·0 cites·13 claims
- 2354US9165723B2Switches for use in microelectromechanical and other systems, and processes for making sameHARRIS CORP·Filed 2012·Granted Oct 20, 2015·0 cites·20 claims
- 2454US9053873B2Switches for use in microelectromechanical and other systems, and processes for making sameHARRIS CORP·Filed 2012·Granted Jun 9, 2015·0 cites·20 claims
- 2552US9892984B2Embedded electronic packaging and associated methodsHARRIS CORP·Filed 2016·Granted Feb 13, 2018·0 cites·21 claims
- 2652US9059317B2Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devicesHARRIS CORP·Filed 2014·Granted Jun 16, 2015·0 cites·22 claims
- 2752US8539666B2Method for making an electrical inductor and related inductor devicesWEATHERSPOON MICHAEL RAYMOND·Filed 2011·Granted Sep 24, 2013·0 cites·19 claims
- 2851US10056670B2Method for making electrical structure with air dielectric and related electrical structuresHARRIS CORP·Filed 2015·Granted Aug 21, 2018·0 cites·21 claims
- 2948US9681543B2Method for making electronic device with cover layer with openings and related devicesHARRIS CORP·Filed 2016·Granted Jun 13, 2017·0 cites·22 claims
- 3047US2011104388A1Method for making an optical device including a curable index matching elastomeric solid layerHARRIS CORP·Filed 2009·Application pending·0 cites
- 3139US2014055215A1Distributed element filters for ultra-broadband communicationsROGERS JOHN E·Filed 2012·Application pending·0 cites
- 3234US2012098129A1Method of making a multi-chip module having a reduced thickness and related devicesREED THOMAS·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →