P

Inventor

CHENG JAO-CHIN

TW8 patents
⚠️ This page may combine multiple inventors who share the name “CHENG JAO-CHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIMICRON TECHNOLOGY CORP

4 patents
US6506632B1Jan 14, 2003

Method of forming IC package having downward-facing chip cavity

UNIMICRON TECHNOLOGY CORP164 citations98
US6506633B1Jan 14, 2003

Method of fabricating a multi-chip module package

UNIMICRON TECHNOLOGY CORP81 citations97
US6709897B2Mar 23, 2004

Method of forming IC package having upward-facing chip cavity

UNIMICRON TECHNOLOGY CORP64 citations95
US6448170B1Sep 10, 2002

Method of producing external connector for substrate

UNIMICRON TECHNOLOGY CORP3 citations52

AMIC TECHNOLOGY INC

2 patents
US6384613B1May 7, 2002

Wafer burn-in testing method

AMIC TECHNOLOGY INC24 citations91
US6673652B1Jan 6, 2004

Underfilling method for a flip-chip packaging process

AMIC TECHNOLOGY INC2 citations61

WORLD WISER ELECTRICS INC

1 patent
US6395633B1May 28, 2002

Method of forming micro-via

WORLD WISER ELECTRICS INC96 citations91

UNIMICRON TAIWAN CORP

1 patent
US6749737B2Jun 15, 2004

Method of fabricating inter-layer solid conductive rods

UNIMICRON TAIWAN CORP45 citations90