Inventor · disambiguated record
Jeremy Mccutcheon
Also filed as: MCCUTCHEON JEREMY · MCCUTCHEON JEREMY W
11 granted patents·3 pending applications·98 citations·filing 2001–2014
89Inventor score
Technology areasH10P
Top patents by PatentIndex Score
14 records- 0192US8852391B2Method and apparatus for removing a reversibly mounted device wafer from a carrier substrateMCCUTCHEON JEREMY W·Filed 2010·Granted Oct 7, 2014·32 cites·32 claims
- 0289US9111981B2Method for reversibly mounting a device wafer to a carrier substrateFLAIM TONY D·Filed 2009·Granted Aug 18, 2015·16 cites·31 claims
- 0386US9263314B2Multiple bonding layers for thin-wafer handlingPULIGADDA RAMA·Filed 2011·Granted Feb 16, 2016·8 cites·5 claims
- 0481US9099512B2Article including a device wafer reversibly mountable to a carrier substrateFLAIM TONY D·Filed 2010·Granted Aug 4, 2015·5 cites·28 claims
- 0576US10103048B2Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substratesBREWER SCIENCE INC·Filed 2014·Granted Oct 16, 2018·3 cites·24 claims
- 0674US6598765B2Disposable syringe dispenser systemBREWER SCIENCE INC·Filed 2001·Granted Jul 29, 2003·22 cites·50 claims
- 0773US7775785B2Contact planarization apparatusBREWER SCIENCE INC·Filed 2006·Granted Aug 17, 2010·4 cites·22 claims
- 0870US9224631B2Multiple bonding layers for thin-wafer handlingBREWER SCIENCE INC·Filed 2014·Granted Dec 29, 2015·1 cites·12 claims
- 0963US7790231B2Automated process and apparatus for planarization of topographical surfacesBREWER SCIENCE INC·Filed 2004·Granted Sep 7, 2010·7 cites·15 claims
- 1059US9472436B2Multiple bonding layers for thin-wafer handlingBREWER SCIENCE INC·Filed 2014·Granted Oct 18, 2016·0 cites·10 claims
- 1159US2015122426A1Multiple bonding layers for thin-wafer handlingBREWER SCIENCE INC·Filed 2014·Application pending·0 cites
- 1241US2007105384A1Automated process and apparatus for planarization of topographical surfacesMCCUTCHEON JEREMY·Filed 2007·Application pending·0 cites
- 1337US9827757B2Methods of transferring device wafers or layers between carrier substrates and other surfacesMCCUTCHEON JEREMY·Filed 2012·Granted Nov 28, 2017·0 cites·28 claims
- 1432US2013061869A1Use of megasonic energy to assist edge bond removal in a zonal temporary bonding processMCCUTCHEON JEREMY·Filed 2012·Application pending·0 cites
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