Inventor
CHOPRA DINESH
US81 patents
Patents
50 patentsUS6551935B1Apr 22, 2003
Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
MICRON TECHNOLOGY INC147 citations99
US6361411B1Mar 26, 2002
Method for conditioning polishing surface
MICRON TECHNOLOGY INC88 citations99
US6328632B1Dec 11, 2001
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC166 citations99
US6313038B1Nov 6, 2001
Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
MICRON TECHNOLOGY INC116 citations99
US6276996B1Aug 21, 2001
Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
MICRON TECHNOLOGY INC239 citations99
US6273786B1Aug 14, 2001
Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
MICRON TECHNOLOGY INC206 citations99
US6250994B1Jun 26, 2001
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
MICRON TECHNOLOGY INC243 citations99
US6206756B1Mar 27, 2001
Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
MICRON TECHNOLOGY INC273 citations99
US6196899B1Mar 6, 2001
Polishing apparatus
MICRON TECHNOLOGY INC160 citations99
US6039633AMar 21, 2000
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC319 citations99
US6602117B1Aug 5, 2003
Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
MICRON TECHNOLOGY INC82 citations98
US6579799B2Jun 17, 2003
Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
MICRON TECHNOLOGY INC93 citations98
US6548407B1Apr 15, 2003
Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
MICRON TECHNOLOGY INC93 citations98
US6221763B1Apr 24, 2001
Method of forming a metal seed layer for subsequent plating
MICRON TECHNOLOGY INC98 citations98
US7005379B2Feb 28, 2006
Semiconductor processing methods for forming electrical contacts
MICRON TECHNOLOGY INC37 citations96
US6676484B2Jan 13, 2004
Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
MICRON TECHNOLOGY INC64 citations96
US6511912B1Jan 28, 2003
Method of forming a non-conformal layer over and exposing a trench
MICRON TECHNOLOGY INC56 citations96
US6413858B1Jul 2, 2002
Barrier and electroplating seed layer
MICRON TECHNOLOGY INC40 citations96
US6354919B2Mar 12, 2002
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC66 citations96
US6419554B2Jul 16, 2002
Fixed abrasive chemical-mechanical planarization of titanium nitride
MICRON TECHNOLOGY INC41 citations94
US7335935B2Feb 26, 2008
Semiconductor structures
MICRON TECHNOLOGY INC32 citations93
US7129160B2Oct 31, 2006
Method for simultaneously removing multiple conductive materials from microelectronic substrates
MICRON TECHNOLOGY INC21 citations93
US7118686B2Oct 10, 2006
Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
MICRON TECHNOLOGY INC23 citations93
US7041595B2May 9, 2006
Method of forming a barrier seed layer with graded nitrogen composition
MICRON TECHNOLOGY INC25 citations93
US6852618B2Feb 8, 2005
Combined barrier layer and seed layer
MICRON TECHNOLOGY INC22 citations93
US6736926B2May 18, 2004
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
MICRON TECHNOLOGY INC16 citations93
US6672949B2Jan 6, 2004
Polishing apparatus
MICRON TECHNOLOGY INC17 citations93
US6613671B1Sep 2, 2003
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
MICRON TECHNOLOGY INC19 citations93
US6561878B2May 13, 2003
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
MICRON TECHNOLOGY INC13 citations93
US6545357B2Apr 8, 2003
Metal nitride barrier layer and electroplating seed layer with the same metal as the metal nitride layer
MICRON TECHNOLOGY INC22 citations93
US6489235B2Dec 3, 2002
Method of forming a metal seed layer for subsequent plating
MICRON TECHNOLOGY INC17 citations93
US6429133B1Aug 6, 2002
Composition compatible with aluminum planarization and methods therefore
MICRON TECHNOLOGY INC35 citations93
US7329607B2Feb 12, 2008
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
MICRON TECHNOLOGY INC10 citations84
US7214614B2May 8, 2007
System for controlling metal formation processes using ion implantation
MICRON TECHNOLOGY INC11 citations84
US6703309B1Mar 9, 2004
Method of reducing oxidation of metal structures using ion implantation, and device formed by such method
MICRON TECHNOLOGY INC13 citations84
US6620032B2Sep 16, 2003
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC13 citations84
US6964602B2Nov 15, 2005
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
MICRON TECHNOLOGY INC10 citations82
US6712676B2Mar 30, 2004
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
MICRON TECHNOLOGY INC8 citations82
US7220663B2May 22, 2007
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
MICRON TECHNOLOGY INC4 citations74
US7109112B2Sep 19, 2006
Method of providing a structure using self-aligned features
MICRON TECHNOLOGY INC8 citations74
US7063603B2Jun 20, 2006
Method and apparatus for cleaning a web-based chemical mechanical planarization system
MICRON TECHNOLOGY INC9 citations74
US6932687B2Aug 23, 2005
Planarizing pads for planarization of microelectronic substrates
MICRON TECHNOLOGY INC6 citations74
US6830500B2Dec 14, 2004
Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
MICRON TECHNOLOGY INC5 citations74
US6756301B2Jun 29, 2004
Method of forming a metal seed layer for subsequent plating
MICRON TECHNOLOGY INC6 citations74
US6756678B2Jun 29, 2004
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
MICRON TECHNOLOGY INC7 citations74
US6746316B2Jun 8, 2004
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
MICRON TECHNOLOGY INC6 citations74
US6736869B1May 18, 2004
Method for forming a planarizing pad for planarization of microelectronic substrates
MICRON TECHNOLOGY INC10 citations74
US6730609B2May 4, 2004
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device
MICRON TECHNOLOGY INC6 citations74
US6720265B2Apr 13, 2004
Composition compatible with aluminum planarization and methods therefore
MICRON TECHNOLOGY INC7 citations74
US6716090B2Apr 6, 2004
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
MICRON TECHNOLOGY INC2 citations74
Showing the top 50 of 81 patents by PatentIndex Score.