Inventor · disambiguated record
Hieu Lam
Also filed as: LAM HIEU · LAM HIEU A
9 granted patents·2 pending applications·114 citations·filing 2003–2008
88Inventor score
Top patents by PatentIndex Score
11 records- 0183US7213478B2Method for automatic configuration of processing systemTOKYO ELECTRON LTD·Filed 2004·Granted May 8, 2007·41 cites·36 claims
- 0281US7844559B2Method and system for predicting process performance using material processing tool and sensor dataTOKYO ELECTRON LTD·Filed 2008·Granted Nov 30, 2010·7 cites·19 claims
- 0377US7167766B2Controlling a material processing tool and performance dataTOKYO ELECTRON LTD·Filed 2003·Granted Jan 23, 2007·24 cites·33 claims
- 0475US8048326B2Method and apparatus for determining an etch property using an endpoint signalTOKYO ELECTRON LTD·Filed 2003·Granted Nov 1, 2011·18 cites·21 claims
- 0574US6825920B2Method and system of determining chamber seasoning condition by optical emissionTOKYO ELECTRON LTD·Filed 2003·Granted Nov 30, 2004·15 cites·41 claims
- 0671US7914657B2Controlling the thickness of wafers during the electroplating processHITACHI GLOBAL STORAGE TECH NL·Filed 2005·Granted Mar 29, 2011·2 cites·21 claims
- 0755US7713760B2Process system health index and method of using the sameTOKYO ELECTRON LTD·Filed 2004·Granted May 11, 2010·5 cites·11 claims
- 0852US7430496B2Method and apparatus for using a pressure control system to monitor a plasma processing systemTOKYO ELECTRON LTD·Filed 2004·Granted Sep 30, 2008·2 cites·9 claims
- 0947US7211196B2Method and system of discriminating substrate typeTOKYO ELECTRON LTD·Filed 2004·Granted May 1, 2007·0 cites·8 claims
- 1047US2009311634A1Method of double patterning using sacrificial structureTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 1140US2005252884A1Method and system for predicting process performance using material processing tool and sensor dataTOKYO ELECTRON LTD·Filed 2003·Application pending·0 cites
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