Inventor

MORGAN PAUL A

US40 patents

⚠️ This page may combine multiple inventors who share the name “MORGAN PAUL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MORGAN PAUL A

MICRON TECHNOLOGY INC

Method and apparatus for etch of a specific subarea of a semiconductor work object

High aspect ratio fill method and resulting structure

High aspect ratio fill method and resulting structure

Delivery of dissolved ozone

Method to isolate device layer edges through mechanical spacing

Delivery of dissolved ozone

Copper post-etch cleaning process

System and method for mixing a gas into a solvent used in semiconductor processing

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions

Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates

Structure and method for field emitter tips

Ruthenium silicide processing methods

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

Device with layer edges separated through mechanical spacing

Wafer Cleaning method and resulting wafer

Methods using a peroxide-generating compound to remove group VIII metal-containing residue

Copper post-etch cleaning process

Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates

Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates

Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

Methods of forming semiconductor constructions, and methods of selectively removing metal-containing materials relative to oxide

Etching processes for integrated circuit manufacturing including methods of forming capacitors

Methods and compositions for removing group VIII metal-containing materials from surfaces

Wafer cleaning method and resulting wafer

Structure and method for field emitter tips

MORGAN PAUL A

Selective metal deposition over dielectric layers

Selective metal deposition over dielectric layers

Selective metal deposition over dielectric layers

KIEHLBAUCH MARK W

Methods of removing silicon oxide

Gaseous compositions comprising hydrogen fluoride and an alkylated ammonia derivative

LODESTAR LICENSING GROUP LLC

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

DAYCOCK DAVID A

Method of reducing damage to an electron beam inspected semiconductor substrate, and methods of inspecting a semiconductor substrate

Method of reducing electron beam damage on post W-CMP wafers

ZHOU BAOSUO

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

KIEHLBAUCH MARK

Methods for treating surfaces, and methods for removing one or more materials from surfaces