Inventor
MISRA EKTA
US22 patents
⚠️ This page may combine multiple inventors who share the name “MISRA EKTA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS9754905B1Sep 5, 2017
Final passivation for wafer level warpage and ULK stress reduction
IBM6 citations83
US10090271B1Oct 2, 2018
Metal pad modification
IBM6 citations81
US9159696B2Oct 13, 2015
Plug via formation by patterned plating and polishing
IBM6 citations73
US8937009B2Jan 20, 2015
Far back end of the line metallization method and structures
IBM6 citations73
US10373925B2Aug 6, 2019
Metal pad modification
IBM1 citations70
US8778792B2Jul 15, 2014
Solder bump connections
IBM3 citations62
US11756911B2Sep 12, 2023
Metal pad modification
IBM0 citations60
US10622319B2Apr 14, 2020
Final passivation for wafer level warpage and ULK stress reduction
IBM0 citations51
US9214385B2Dec 15, 2015
Semiconductor device including passivation layer encapsulant
IBM0 citations51
US8674506B2Mar 18, 2014
Structures and methods to reduce maximum current density in a solder ball
IBM1 citations51
US9431359B2Aug 30, 2016
Coaxial solder bump support structure
IBM0 citations50
US10593639B2Mar 17, 2020
Metal pad modification
IBM0 citations49
DAUBENSPECK TIMOTHY H
3 patentsUS8492892B2Jul 23, 2013
Solder bump connections
DAUBENSPECK TIMOTHY H6 citations83
US8298929B2Oct 30, 2012
Offset solder vias, methods of manufacturing and design structures
DAUBENSPECK TIMOTHY H4 citations62
US8299581B2Oct 30, 2012
Passivation layer extension to chip edge
DAUBENSPECK TIMOTHY H3 citations59
GLOBALFOUNDRIES INC
3 patentsUS9633962B2Apr 25, 2017
Plug via formation with grid features in the passivation layer
GLOBALFOUNDRIES INC0 citations52
US10096557B2Oct 9, 2018
Tiled-stress-alleviating pad structure
GLOBALFOUNDRIES INC0 citations50
US9842810B1Dec 12, 2017
Tiled-stress-alleviating pad structure
GLOBALFOUNDRIES INC1 citations50