P

Inventor

YUAN ZHONGFA

CN6 patents
⚠️ This page may combine multiple inventors who share the name “YUAN ZHONGFA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU YONG

3 patents
US8106406B2Jan 31, 2012

Die package including substrate with molded device

LIU YONG12 citations82
US8525192B2Sep 3, 2013

Die package including substrate with molded device

LIU YONG0 citations50
US8120169B2Feb 21, 2012

Thermally enhanced molded leadless package

LIU YONG0 citations40

FAIRCHILD SEMICONDUCTOR

3 patents
US7589338B2Sep 15, 2009

Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice

FAIRCHILD SEMICONDUCTOR12 citations81
US7768108B2Aug 3, 2010

Semiconductor die package including embedded flip chip

FAIRCHILD SEMICONDUCTOR12 citations78
US7745244B2Jun 29, 2010

Pin substrate and package

FAIRCHILD SEMICONDUCTOR4 citations62