Inventor
LIN YU-HUNG
TW98 patents
⚠️ This page may combine multiple inventors who share the name “LIN YU-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
26 patentsUS9831183B2Nov 28, 2017
Contact structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD493 citations98
US9576908B1Feb 21, 2017
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations93
US11482497B2Oct 25, 2022
Package structure including a first die and a second die and a bridge die and method of forming the package structure
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US10297548B2May 21, 2019
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9735050B2Aug 15, 2017
Composite contact plug structure and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9721896B2Aug 1, 2017
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US12033949B2Jul 9, 2024
Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11682625B2Jun 20, 2023
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276432B2Apr 30, 2019
Composite contact plug structure and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10079174B2Sep 18, 2018
Composite contact plug structure and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9984924B2May 29, 2018
Semiconductor device and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9966339B2May 8, 2018
Barrier structure for copper interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9589892B2Mar 7, 2017
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11450612B2Sep 20, 2022
Semiconductor devices and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10756017B2Aug 25, 2020
Contact structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9793204B2Oct 17, 2017
Method of manufacturing semiconductor structure comprising plurality of through holes using metal hard mask
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9773779B2Sep 26, 2017
Semiconductor structure with resistor layer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9966304B2May 8, 2018
Method for forming interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US11854874B2Dec 26, 2023
Metal contact structure and method of forming the same in a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11749603B2Sep 5, 2023
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11404376B2Aug 2, 2022
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11049813B2Jun 29, 2021
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10985058B2Apr 20, 2021
Semiconductor device and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9530736B2Dec 27, 2016
Semiconductor device and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12554064B2Feb 17, 2026
Photonic assembly for enhanced bonding yield and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12543604B2Feb 3, 2026
Adding sealing material to wafer edge for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
KUANG YING COMP EQUIPMENT CO
8 patentsUS9601883B1Mar 21, 2017
USB connector
KUANG YING COMP EQUIPMENT CO11 citations83
US9385481B2Jul 5, 2016
Electronic connector
KUANG YING COMP EQUIPMENT CO10 citations83
US8827750B2Sep 9, 2014
Application structure for electric wave effect of transmission conductor
KUANG YING COMP EQUIPMENT CO10 citations83
US8777672B2Jul 15, 2014
USB female connector
KUANG YING COMP EQUIPMENT CO15 citations83
US8662936B2Mar 4, 2014
USB female connector
KUANG YING COMP EQUIPMENT CO12 citations83
US9147979B1Sep 29, 2015
Electric connector
KUANG YING COMP EQUIPMENT CO15 citations81
US8864528B2Oct 21, 2014
USB 3.0 two-way socket jack connector structure
KUANG YING COMP EQUIPMENT CO4 citations73
US9306300B2Apr 5, 2016
Obversely and reversely pluggable connector structure
KUANG YING COMP EQUIPMENT CO3 citations66
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9230795B1Jan 5, 2016
Directional pre-clean in silicide and contact formation
TAIWAN SEMICONDUCTOR MFG24 citations94
US8722531B1May 13, 2014
Barrier layer for copper interconnect
TAIWAN SEMICONDUCTOR MFG13 citations90
US8872342B2Oct 28, 2014
Barrier layer for copper interconnect
TAIWAN SEMICONDUCTOR MFG4 citations82
US9385080B2Jul 5, 2016
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG4 citations73
US9368357B2Jun 14, 2016
Directional pre-clean in silicide and contact formation
TAIWAN SEMICONDUCTOR MFG4 citations73
LIN YU-HUNG
2 patentsETASIS ELECTRONICS CORP
2 patents(unassigned)
1 patentRONG CHANG METAL CO LTD
1 patentLIN YU HUNG
1 patentMEDIATEK INC
1 patentSIGNAL CABLE SYSTEM CO LTD
1 patentV GENERAL TECH CO LTD
1 patentTAIWAN SEMICONDUCTOR MFG COMPANY LTD
1 patentShowing the top 50 of 98 patents by PatentIndex Score.