P

Inventor

LIN YU-HUNG

TW98 patents
⚠️ This page may combine multiple inventors who share the name “LIN YU-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US9831183B2Nov 28, 2017

Contact structure and method of forming

TAIWAN SEMICONDUCTOR MFG CO LTD493 citations98
US9576908B1Feb 21, 2017

Interconnection structure, fabricating method thereof, and semiconductor device using the same

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations93
US11482497B2Oct 25, 2022

Package structure including a first die and a second die and a bridge die and method of forming the package structure

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US10297548B2May 21, 2019

Interconnection structure, fabricating method thereof, and semiconductor device using the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9735050B2Aug 15, 2017

Composite contact plug structure and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9721896B2Aug 1, 2017

Interconnection structure, fabricating method thereof, and semiconductor device using the same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US12033949B2Jul 9, 2024

Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11682625B2Jun 20, 2023

Interconnection structure, fabricating method thereof, and semiconductor device using the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276432B2Apr 30, 2019

Composite contact plug structure and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10079174B2Sep 18, 2018

Composite contact plug structure and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9984924B2May 29, 2018

Semiconductor device and formation thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9966339B2May 8, 2018

Barrier structure for copper interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9589892B2Mar 7, 2017

Interconnect structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11450612B2Sep 20, 2022

Semiconductor devices and methods of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10756017B2Aug 25, 2020

Contact structure and method of forming

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9793204B2Oct 17, 2017

Method of manufacturing semiconductor structure comprising plurality of through holes using metal hard mask

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9773779B2Sep 26, 2017

Semiconductor structure with resistor layer and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9966304B2May 8, 2018

Method for forming interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US11854874B2Dec 26, 2023

Metal contact structure and method of forming the same in a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11749603B2Sep 5, 2023

Interconnection structure, fabricating method thereof, and semiconductor device using the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11404376B2Aug 2, 2022

Interconnection structure, fabricating method thereof, and semiconductor device using the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11049813B2Jun 29, 2021

Interconnection structure, fabricating method thereof, and semiconductor device using the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10985058B2Apr 20, 2021

Semiconductor device and formation thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9530736B2Dec 27, 2016

Semiconductor device and formation thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12554064B2Feb 17, 2026

Photonic assembly for enhanced bonding yield and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12543604B2Feb 3, 2026

Adding sealing material to wafer edge for wafer bonding

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

KUANG YING COMP EQUIPMENT CO

8 patents

TAIWAN SEMICONDUCTOR MFG

5 patents

LIN YU-HUNG

2 patents

ETASIS ELECTRONICS CORP

2 patents

(unassigned)

1 patent

RONG CHANG METAL CO LTD

1 patent

LIN YU HUNG

1 patent

MEDIATEK INC

1 patent

SIGNAL CABLE SYSTEM CO LTD

1 patent

V GENERAL TECH CO LTD

1 patent

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

1 patent

Showing the top 50 of 98 patents by PatentIndex Score.