Inventor

BAI YIQUN

US19 patents

⚠️ This page may combine multiple inventors who share the name “BAI YIQUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAI YIQUN

INTEL CORP

Integrated micro-channels for 3D through silicon architectures

Integrated micro-channels for 3D through silicon architectures

Trenches in wafer level packages for improvements in warpage reliability and thermals

Coupled cooling fins in ultra-small systems

Completely encapsulated optical multi chip package

Thermal management solutions for integrated circuit packages

Dummy die structures of a packaged integrated circuit device

High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package

Method for reducing underfill filler settling in integrated circuit packages

Hydrophobic feature to control adhesive flow

Narrow-gap flip chip underfill composition

Narrow-gap flip chip underfill composition

Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures

Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures

Mold compound with reinforced fibers

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Integrated heat spreader comprising a silver and sintering silver layered structure

XIU YONGHAO

Epoxy-amine underfill materials for semiconductor packages

BAI YIQUN

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby