Inventor · disambiguated record
Romarico Santos San Antonio
Also filed as: SAN ANTONIO ROMARICO S · SAN ANTONIO ROMARICO SANTOS
23 granted patents·2 pending applications·973 citations·filing 2002–2011
97Inventor score
Files withUNISEM MAURITIUS HOLDINGS LTD14ADVANCED INTERCONNECT TECH LTD4SAN ANTONIO ROMARICO S3ISLAM SHAFIDUL1SAN ANTONIO ROMARICO SANTOS1
Top patents by PatentIndex Score
25 records- 0198US6812552B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2002·Granted Nov 2, 2004·264 cites·12 claims
- 0297US7262491B2Die pad for semiconductor packages and methods of making and using sameADVANCED INTERCONNECT TECH LTD·Filed 2005·Granted Aug 28, 2007·89 cites·18 claims
- 0395US7790500B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Sep 7, 2010·86 cites·19 claims
- 0495US7622332B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2005·Granted Nov 24, 2009·36 cites·12 claims
- 0593US7799611B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2006·Granted Sep 21, 2010·40 cites·33 claims
- 0693US7741158B2Method of making thermally enhanced substrate-base packageUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Jun 22, 2010·109 cites·8 claims
- 0792US8084300B1RF shielding for a singulated laminate semiconductor device packageSAN ANTONIO ROMARICO S·Filed 2010·Granted Dec 27, 2011·56 cites·25 claims
- 0892US7943431B2Leadless semiconductor package and method of manufactureUNISEM MAURITIUS HOLDINGS LTD·Filed 2006·Granted May 17, 2011·28 cites·14 claims
- 0992US7129116B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Oct 31, 2006·41 cites·11 claims
- 1091US8236612B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingSAN ANTONIO ROMARICO S·Filed 2011·Granted Aug 7, 2012·24 cites·16 claims
- 1186US7820480B2Lead frame routed chip pads for semiconductor packagesUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Oct 26, 2010·12 cites·8 claims
- 1286US7709935B2Reversible leadless package and methods of making and using sameUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted May 4, 2010·39 cites·12 claims
- 1385US6777265B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2003·Granted Aug 17, 2004·43 cites·13 claims
- 1483US7816186B2Method for making QFN package with power and ground ringsUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Oct 19, 2010·12 cites·20 claims
- 1583US7700414B1Method of making flip-chip package with underfillUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Apr 20, 2010·22 cites·12 claims
- 1682US8058104B2Reversible leadless package and methods of making and using sameISLAM SHAFIDUL·Filed 2010·Granted Nov 15, 2011·8 cites·6 claims
- 1775US7795710B2Lead frame routed chip pads for semiconductor packagesUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted Sep 14, 2010·19 cites·14 claims
- 1872US7563648B2Semiconductor device package and method for manufacturing sameUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted Jul 21, 2009·23 cites·33 claims
- 1968US7439097B2Taped lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2005·Granted Oct 21, 2008·4 cites·7 claims
- 2064US8022512B2No lead package with heat spreaderUNISEM MAURITUS HOLDINGS LTD·Filed 2007·Granted Sep 20, 2011·4 cites·5 claims
- 2164US7554180B2Package having exposed integrated circuit deviceUNISEM MAURITIUS HOLDINGS LTD·Filed 2003·Granted Jun 30, 2009·11 cites·6 claims
- 2259US8304864B2Lead frame routed chip pads for semiconductor packagesSAN ANTONIO ROMARICO SANTOS·Filed 2010·Granted Nov 6, 2012·2 cites·58 claims
- 2358US8053869B2Package having exposed integrated circuit deviceUNISEM MAURITIUS HOLDINGS LTD·Filed 2009·Granted Nov 8, 2011·1 cites·11 claims
- 2435US2004058478A1Taped lead frames and methods of making and using the same in semiconductor packagingFiled 2002·Application pending·0 cites
- 2534US2012126378A1Semiconductor device package with electromagnetic shieldingSAN ANTONIO ROMARICO S·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →