Inventor · disambiguated record
Romeo Emmanuel P. Alvarez
Also filed as: ALVAREZ ROMEO EMMANUEL P
7 granted patents·3 pending applications·257 citations·filing 2001–2009
88Inventor score
Top patents by PatentIndex Score
10 records- 0195US7566650B2Integrated circuit solder bumping systemSTATS CHIPPAC LTD·Filed 2005·Granted Jul 28, 2009·42 cites·12 claims
- 0292US6732913B2Method for forming a wafer level chip scale package, and package formed therebyADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·90 cites·40 claims
- 0392US6510976B2Method for forming a flip chip semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Jan 28, 2003·75 cites·41 claims
- 0489US8008770B2Integrated circuit package system with bump padSTATS CHIPPAC LTD·Filed 2006·Granted Aug 30, 2011·22 cites·20 claims
- 0584US8487438B2Integrated circuit system having different-size solder bumps and different-size bonding padsLIN YAOJIAN·Filed 2009·Granted Jul 16, 2013·10 cites·4 claims
- 0684US7169641B2Semiconductor package with selective underfill and fabrication method therforSTATS CHIPPAC LTD·Filed 2005·Granted Jan 30, 2007·13 cites·20 claims
- 0757US7410824B2Method for solder bumping, and solder-bumping structures produced therebySTATS CHIPPAC LTD·Filed 2004·Granted Aug 12, 2008·5 cites·10 claims
- 0854US2008230925A1Solder-bumping structures produced by a solder bumping methodDO BYUNG TAI·Filed 2008·Application pending·0 cites
- 0939US2004198022A1Method for forming a wafer level chip scale package, and package formed therebyADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 1035US2004130034A1Method for forming a wafer level chip scale packageADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
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