Inventor
KAO CHIN-LI
TW25 patents
Patents
25 patentsUS10134677B1Nov 20, 2018
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG20 citations93
US9773753B1Sep 26, 2017
Semiconductor devices and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG30 citations90
US11127650B2Sep 21, 2021
Semiconductor device package including thermal dissipation element and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG8 citations83
US9478500B2Oct 25, 2016
Interposer substrate, semiconductor structure and fabricating process thereof
ADVANCED SEMICONDUCTOR ENG10 citations82
US10332862B2Jun 25, 2019
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG6 citations81
US10037974B2Jul 31, 2018
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG10 citations81
US9589840B2Mar 7, 2017
Semiconductor package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG4 citations73
US9917043B2Mar 13, 2018
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US9891048B2Feb 13, 2018
Measurement equipment
ADVANCED SEMICONDUCTOR ENG4 citations69
US11309253B2Apr 19, 2022
Package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US11257776B2Feb 22, 2022
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US7482204B2Jan 27, 2009
Chip packaging process
ADVANCED SEMICONDUCTOR ENG4 citations61
US7335982B2Feb 26, 2008
Chip package structure and chip packaging process
ADVANCED SEMICONDUCTOR ENG2 citations61
US11011444B2May 18, 2021
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG1 citations60
US12494446B2Dec 9, 2025
Package structures and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations58
US11621217B2Apr 4, 2023
Substrate structure and semiconductor package structure
ADVANCED SEMICONDUCTOR ENG1 citations57
US11430761B2Aug 30, 2022
Semiconductor package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations56
US12113044B2Oct 8, 2024
Semiconductor package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations53
US11244909B2Feb 8, 2022
Package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations53
US10056325B2Aug 21, 2018
Semiconductor package having a trench penetrating a main body
ADVANCED SEMICONDUCTOR ENG0 citations52
US10541198B2Jan 21, 2020
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations51
US9589871B2Mar 7, 2017
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations51
US11855034B2Dec 26, 2023
Electronic device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations49
US10840219B2Nov 17, 2020
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations49
US10222209B2Mar 5, 2019
Measurement equipment
ADVANCED SEMICONDUCTOR ENG0 citations48