P
US10222209B2ActiveUtilityPatentIndex 48

Measurement equipment

Assignee: ADVANCED SEMICONDUCTOR ENGPriority: Jan 29, 2014Filed: Jan 4, 2018Granted: Mar 5, 2019
Est. expiryJan 29, 2034(~7.6 yrs left)· nominal 20-yr term from priority
Inventors:PARK SEUNGBAEHSU YU-HOKAO CHIN-LIHUANG TAI-YUAN
G01B 2210/56G01C 11/04G01B 11/245
48
PatentIndex Score
0
Cited by
15
References
23
Claims

Abstract

The measurement equipment includes a rack, a first image capturing device, a second image capturing device, a third image capturing device and a fourth image capturing device. Wherein, the first image capturing device and the second image capturing device capture an entire image of a to-be-measured object, the third image capturing device and the fourth image capturing device capture a plurality of local images of a plurality of local areas of the to-be-measured object, and the entire image and the local images and are simultaneously captured.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A measurement equipment comprising:
 a first camera; 
 a second camera; 
 a third camera; and 
 a fourth camera; 
 wherein the first camera and the second camera are disposed at different positions relative to a to-be-measured object; 
 wherein the third camera and the fourth camera are disposed at different positions relative to the to-be-measured object; and 
 wherein the first camera and the second camera are configured to capture an entire image of the to-be-measured object, the entire image of the to-be-measured object is captured by the first camera and the second camera by simultaneously focusing on the to-be-measured object, the third camera and the fourth camera are configured to capture a plurality of local images of a plurality of local areas of the to-be-measured object, and each of the local images is captured by the third camera and the fourth camera by simultaneously focusing on a corresponding one of the local areas of the to-be-measured object. 
 
     
     
       2. The measurement equipment of  claim 1 , further comprising a rack, wherein the first camera, the second camera, the third camera and the fourth camera are disposed on the rack. 
     
     
       3. The measurement equipment of  claim 2 , further comprising:
 a light emitting device pivotally connected to the rack. 
 
     
     
       4. The measurement equipment of  claim 3 , wherein the light emitting device comprises:
 an adjustable component pivotally connected to the rack; and 
 a light-emitting component pivotally connected to the adjustable component. 
 
     
     
       5. The measurement equipment of  claim 1 , further comprising a processing device connected to the first camera, the second camera, the third camera, and the fourth camera, the processing device configured to analyze the entire image and the local images to obtain in-plane deformation, distortion and warpage of the to-be-measured object. 
     
     
       6. The measurement equipment of  claim 5 , wherein the processing device comprises:
 a control component configured to control the third camera and the fourth camera to move. 
 
     
     
       7. The measurement equipment of  claim 1 , wherein the first camera and the second camera are disposed above the third camera and the fourth camera. 
     
     
       8. The measurement equipment of  claim 1 , further comprising:
 a motorized linear stage configured to drive the third camera and the fourth camera. 
 
     
     
       9. The measurement equipment of  claim 8 , wherein the motorized linear stage comprises:
 a first rail extended along a first sliding direction, wherein the third camera and the fourth camera are movably disposed on the first rail; and 
 a second rail extended along a second sliding direction, wherein the first rail is movably disposed on the second rail. 
 
     
     
       10. The measurement equipment of  claim 1 , further comprising:
 an environmental chamber for accommodating the to-be-measured object. 
 
     
     
       11. The measurement equipment of  claim 1 , further comprising:
 a joystick configured to control the third camera and the fourth camera device to move. 
 
     
     
       12. The measurement equipment of  claim 1 , wherein a resolution of each local image is higher than a resolution of the entire image. 
     
     
       13. The measurement equipment of  claim 1 , wherein the to-be-measured object is a wafer. 
     
     
       14. The measurement equipment of  claim 1 , further comprising:
 a projector configured to project a plurality of light-spots to the to-be-measured object. 
 
     
     
       15. A measurement equipment comprising:
 a first camera group comprising multiple cameras disposed at different positions relative to a to-be-measured object; and 
 a second camera group comprising multiple cameras disposed at different positions relative to the to-be-measured object; 
 wherein the cameras of the first camera group are configured to capture an entire image of the to-be-measured object, the entire image of the to-be-measured object is captured by the cameras of the first camera group by simultaneously focusing on the to-be-measured object, the cameras of the second camera group are configured to capture a plurality of local images of a plurality of local areas of the to-be-measured object, and each of the local images is captured by the cameras of the second camera group by simultaneously focusing on a corresponding one of the local areas of the to-be-measured object. 
 
     
     
       16. The measurement equipment of  claim 15 , further comprising a processing device connected to the first camera group and the second camera group, the processing device configured to analyze the entire image and the local images to obtain in-plane deformation, distortion and warpage of the to-be-measured object. 
     
     
       17. The measurement equipment of  claim 15 , further comprising:
 a rack; 
 wherein the first camera group comprises a first camera fixedly disposed on the rack and a second camera fixedly disposed on the rack, and the second camera group comprises a third camera movably disposed on the rack and a fourth camera movably disposed on the rack. 
 
     
     
       18. A measurement equipment comprising:
 a first camera group comprising a first camera and a second camera disposed at different positions relative to a to-be-measured object; and 
 a second camera group comprising a third camera and a fourth camera disposed at different positions relative to the to-be-measured object; 
 wherein the first camera and the second camera are configured to simultaneously capture an entire image of the to-be-measured object, and the third camera and the fourth camera are configured to capture a plurality of local images of a plurality of local areas of the to-be-measured object; and 
 wherein a resolution of the second camera group is higher than a resolution of the first camera group. 
 
     
     
       19. The measurement equipment of  claim 18 , further comprising a processing device connected to the first camera group and the second camera group, the processing device configured to analyze the entire image and the local images to obtain in-plane deformation, distortion and warpage of the to-be-measured object. 
     
     
       20. The measurement equipment of  claim 18 , further comprising:
 a projector configured to project a plurality of light-spots to the to-be-measured object. 
 
     
     
       21. The measurement equipment of  claim 18 , further comprising:
 a motorized linear stage configured to drive the second camera group; 
 wherein the motorized linear stage comprises:
 a first rail extended along a first sliding direction, wherein the second camera group is movably disposed on the first rail; and 
 a second rail extended along a second sliding direction, wherein the first rail is movably disposed on the second rail. 
 
 
     
     
       22. The measurement equipment of  claim 18 , wherein the entire image is captured by the first camera and the second camera by simultaneously focusing on the to-be-measured object, and each of the local images is captured by the third camera and the fourth camera by simultaneously focusing on a corresponding one of the local areas of the to-be-measured object. 
     
     
       23. The measurement equipment of  claim 18 , wherein the entire image and the local images are simultaneously captured.

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