Inventor
PARK SEUNGBAE
US8 patents
⚠️ This page may combine multiple inventors who share the name “PARK SEUNGBAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS6288900B1Sep 11, 2001
Warpage compensating heat spreader
IBM88 citations97
US6627998B1Sep 30, 2003
Wafer scale thin film package
IBM58 citations95
US6347901B1Feb 19, 2002
Solder interconnect techniques
IBM20 citations91
US6291776B1Sep 18, 2001
Thermal deformation management for chip carriers
IBM13 citations73
US7348261B2Mar 25, 2008
Wafer scale thin film package
IBM3 citations61